The Internet of Things promises to be the next big disruptive technology as it is expected to augment products and services across industries in ways yet to be discovered. According to forecasters, by 2020 there will be more than 20 billion connected devices, generating annually over 5 trillion gigabytes of data and creating a whopping […]
The Embedded Systems Expo Conference (ESEC) ran from May 11th-13th as part of Japan’s IT week. This year, the VIA booth featured a wide range of Enterprise IoT solutions with a number of live demos targeted at transportation applications on display.
Come and experience the latest in the VIA IoT Mobility Platform during Japan IT week’s Embedded Systems Expo Conference (ESEC) this May 11th – 13th.
Here’s a short introduction to the new VIA Mobile360 In-Vehicle Surround View Fleet Management System given by VIA Marketing Manager Mike Fox at Embedded World this past week. We were very encouraged by the huge levels of interest in the system that we received at the show. To find out more about its 360° real-time […]