VIA and S3 Graphics showcase next generation core-logic chipset & graphics technologies at E3, demonstrating full support for enhanced 3D gaming and an unparalleled multi-screen experience
Los Angeles, USA, May 17 th 2005 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions today announced the demo of VIA DualGFX Express technology at E3 Expo, in Kentia Hall booth #6814 from 18-20 May, along with performance systems featuring cutting edge VIA core-logic chipsets, the latest S3 Graphics PCI-Express GPUs and the VIA Grease Monkey game maintenance application.
VIA DualGFX Express technology enables dual-graphics card platforms providing exceptional 3D graphics performance on a single display, as well as the ability to provide enhanced support for powerful multi-display systems. E3 will see the first public display of the high-performance VIA K8T890 Pro core-logic chipset, running dual graphics cards for enhanced 3D gaming performance. Also being displayed is an advanced multi-display system based on the unique architecture of the VIA PT880 Pro chipset, which supports both PCI Express and AGP graphics interfaces.
S3 Graphics will be demonstrating GammaC-S18, the first in the GammaC line of native PCI Express GPUs targeted at the mainstream graphics market, featuring full DirectX 9.0 hardware and S3G’s signature Hi-Def™ native HDTV display capability for the ultimate visual experience.
Also on show at the VIA booth will be VIA Grease Monkey, an easy-to-use desktop application that ensures up-to-the-minute updates for all of the most popular PC games, eliminating time-consuming online searching and waiting for important updates to download.
VIA DualGFX Express technology is available on a new generation of motherboards entering the market featuring VIA PT880 Pro chipsets for the Intel® Pentium® 4 processor platform. The forthcoming VIA K8T890 Pro chipset will enable VIA DualGFX Express support on the AMD64 processor platform.
At E3 Expo 2005, VIA and S3 Graphics will be located at Kentia Hall, booth number 6814. For more information on VIA DualGFX Express technology, please visit http://www.via.com.tw/en/products/chipsets/dual-gfx/.
About VIA Technologies, Inc
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei , Taiwan , VIA’s global network links the high tech centers of the US , Europe and Asia , and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw
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