Featuring the best performance-per-watt operation and the smallest footprint in the industry, the VIA C7-M ULV mobile processor will power the “SmartCaddie” Ultra Mobile PC from PBJ, Inc., on show at CeBIT 2006
Taipei, Taiwan, 10 March 2006 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA C7-M ULV processor with unprecedented power efficiency that enables an exciting range of ultra compact, ultra portable devices to be showcased at CeBIT 2006.
As users look for a new breed of devices that fuses communication, content support, and computing all in one easy to carry package, VIA C7-M ULV processors are enabling radically small form factor designs that still retain the performance and flexibility of a full PC. Working together with leading industry partners the VIA C7-M ULV processor is creating exciting opportunities for entertainment, productivity, and communication products with a portability never before thought possible.
“The VIA C7-M ULV processor is the result of a concerted design effort to create the world’s lowest power x86 processors that will enable a much needed class of mobile devices,” commented Epan Wu, Deputy Director, CPU Product Marketing, VIA Technologies, Inc. “Featuring the best performance-per-watt operation in the industry, the VIA C7-M ULV processor delivers the performance needed to put a full PC into the palm of your hand.”
“As consumers lead increasingly mobile lifestyles, Ultra Mobile PCs will provide an exciting new solution that makes it easier to access digital content — such as movies and music — and connect to almost anyone, and accomplish virtually any task while on the go,” said Otto Berkes, general manager of the Mobile Platforms Division at Microsoft Corp. “The VIA C7-M ULV processor is enabling the production of smaller form factors that meet the needs of mobile consumers, while maintaining the functionality benefits of a full-sized Windows-based PC.”
Paving the road for a new range of VIA C7-M ULV processor devices is PBJ, Inc., a Japan-based OEM, with their compact “SmartCaddie” UMPC device that together with Microsoft® Windows® XP with Microsoft Touch Pack software is aimed at enabling a revolutionary entertainment experience in the home.
“The VIA C7-M ULV processor has enabled us to create products with outstanding mobile characteristics that open the door to a new way to interact with a PC-based device,” said Masatoshi Takahashi, CEO, PBJ, Inc. The CTO of PBJ, Inc., Kimitoshi Murakami added: “With the VIA C7-M ULV processor’s amazingly low power consumption and cool operation, we were able to achieve battery life and a unique form factor design, while still maintaining the performance one would expect to do everyday PC tasks.”
To see and learn more about the VIA C7-M ULV processor, please stop by the VIA booth at CeBIT (Hannover, Germany, March 9-15) Hall 23, D04, or visit the VIA website at:
For more information on the “SmartCaddie”, please visit: www.smartcaddie.jp, a dedicated UMPC site to be made live on 13th March 2006.
About the VIA C7-M ULV Processor
Based on the VIA CoolStream™ architecture, and manufactured using IBM’s 90nm SOI process, the VIA C7-M ULV processors are available at speeds from 1.0-1.5GHz with a maximum thermal design power (TDP) as low as 3.5 watts, and idle power as little as 0.1 watt ensuring unparalleled battery life. This is complemented by a low profile nanoBGA2 package measuring just 21mm x 21mm enabling designs with drastically reduced weight, size, and thickness. For more information on the VIA C7-M ULV processor, please visit the VIA website at:
The VIA C7-M ULV processor is in mass production now. Please contact your nearest sales office for more details, or email firstname.lastname@example.org.
About PBJ, Inc.
PBJ, Inc. is an innovator of “Keyboard-less and Mouse-less” mobile computer products and solutions, offering the next generation of mobile devices from Japan to the world. www.pbj-inc.co.jp/english/
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw