VIA CEO Wenchi Chen demonstrates how VIA’s industry leadership in miniaturization and power efficiency is driving real system innovation and the proliferation of digital intelligence
Taipei, Taiwan, 7 June 2006 – Wenchi Chen, President and CEO of VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today laid out VIA’s strategy of continuing to push the limits on miniaturization of the PC platform based on its unrivalled power efficiency and rich feature integration.
Centered around the key theme of how miniaturization and integration on the PC platform is accelerating the extension of the PC platform into new form factors, new usage models and new markets, thereby prompting the proliferation of digital intelligence, Mr Chen outlined VIA’s comprehensive strategy covering silicon, platform and system level innovation in driving the transition of the PC to devices with consumer electronics appeal.
“These days, the industry is talking about performance per watt, which is important on a silicon level; however, we believe that the industry should be thinking of new metrics, such as features per square inch at the platform level, and functionality per pound at the mobile system level, or per litre for desktop systems,” said Wenchi Chen, President and CEO, VIA Technologies, Inc.
Underlining these market metrics at the silicon level, Mr Chen showed an early preview of John, the next advance in the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with the very latest core logic integrating both North and South Bridges, the upcoming VIA VX700 mobile chipset. As a processor plus core logic in a single, complete package, John will play an important role in maintaining the pace of miniaturization especially in the mobile space, when it is launched later this year.
At the system level, there was a preview of the VIA Vogue PC, a new concept in personalized PCs that combines a full featured PC module with a “wardrobe” of designer shell outfits, enabling consumers to select a look to suit each environment. More will be revealed in Q3’06 about this exciting concept, which looks set to redefine the lifestyle PC.
Converting Mobile into Handheld
Mr Chen highlighted how VIA’s leadership on power efficiency is the catalyst driving the convergence of notebooks and handhelds into new device categories such as UMPCs, like those of partners TabletKiosk and PBJ, and further to PC phones, such as the DualCor cPC, which combines full PC functionality with a PDA and a phone in a ultra compact handheld form factor. With their unmatched performance per watt operation, VIA’s mobile and UMPC platforms are powered by the highly power efficient VIA C7-M mobile processor family, as the regular and ultra low voltage skus respectively, with corresponding mobile chipsets for feature rich, slimline devices.
Driving Innovation in the Desktop Space
VIA also espoused its strategy on the desktop side, working with partners like AMD on platforms such as the VIA K8M890, which was demonstrated during the keynote running Microsoft® Windows Vista™ Beta 2 with one of the new AMD Socket AM2 processors.
To emphasise VIA’s performance on High Definition Computing platforms, there was an appearance onstage of two Ambassadors, members of the VIA-sponsored girlz 0f destruction PC gaming team; Jamie “Missy” Pereyda, reigning Ms QuakeCon champion, gave an overview of life as a professional gamer and a resident in the eSports training facility in Stockholm, where the girls train with other professional gamers using leading edge VIA and S3 Graphics Hi-Def™ hardware. More information on the Ambassadors can be found at thewww.girlzgaminghouse.com website.
Empowering Emerging Markets through Technology
The VIA pc-1 Initiative is another key area that has greatly benefited from VIA’s leading power efficient technologies, as illustrated by the onstage demonstration of the VIA pc-1 PHD Appliance reference design running off a standard 12V car battery. The PHD appliance is a ruggedized system designed to withstand the environmental challenges of unstable power, and excessive heat and dust prevalent in emerging markets, and able to operate effectively with alternative energy sources such as car batteries and solar power.
Wayan Vota of Geekcorps gave some fascinating insights on the deployment of VIA’s power efficient technologies in the desert regions of Mali, including a broadcast station serving the remote Bourem Inaly community, and a new project to enable marketplace sales of asynchronous cyber services such as email and voicemail, named “Cybertigi”; this will be the focus of Mr Vota’s presentation during Friday’s Emerging Markets Technology Track.
For VIA, Small is Beautiful
“By focusing on miniaturization, VIA is taking an alternative path to enabling true product differentiation at all levels of the industry,” commented Mr Chen. “From innovative approaches to silicon and platform feature integration right through to facilitating system innovation for partners in all areas of the industry, from desktop to mobile to handheld, VIA is allowing partners to add real value and to grow the market for all of us.”
About the VIA Technology Forum
The annual VIA Technology Forum has firmly established itself as one of the most prominent technology events on the industry’s global calendar. Taking place in Taipei, Taiwan this week, VTF2006 introduces a high profile agenda of keynote and specialist track speakers and is supported by key industry players including AMD, Microsoft, Fujitsu and HP. With a theme of “Embracing Digital Intelligence”, VTF2006 has a compelling agenda of senior industry figures sharing their visions and strategies in defining key market and technology trends. For further information on the VIA Technology Forum, please visit our VTF2006 website at: www.via.com.tw/vtf
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw