VIA Enters into Strategic Alliance with Chunghwa Telecom and GIGABYTE to Deliver 3.5G Services for Ultra Mobile Devices

World’s first collaboration between UMD silicon platform, device, and wireless broadband providers will set the global trend for enabling a rich “Mobility 2.0” lifestyle

Taipei, Taiwan, 15 May 2007 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and device platform solutions, today announced with Chunghwa Telecom, Taiwan’s largest telecommunications provider, and GIGABYTE, a leading IT industry brand, a strategic alliance to deliver high speed 3.5G services for UMDs (Ultra Mobile Devices) powered by the VIA C7-M Ultra Mobile Platform.

As a result of this alliance, business users and consumers in Taiwan will be able to enjoy a complete Internet experience by connecting the GIGABYTE U60, a small and light VIA C7-M processor-based UMD running Microsoft Windows Vista, to Chunghwa Telecom’s island-wide HSDPA (High Speed Data Packet Access) network.

“We are delighted to be working with Chunghwa Telecom and GIGABYTE to bring a rich mobility 2.0 Internet experience to Taiwan consumers and business users,” commented Wenchi Chen, President and CEO of VIA Technologies, Inc. “This alliance is an important step forward in achieving our ultramobility vision, and sets the trends for closer cooperation between silicon platform, device and service providers in the future.”

“Wallet-sized full PC functionality with multiple connectivity options and the long battery life enabled by the VIA C7-M Ultra Mobile Platform makes the GIGABYTE U60 a more powerful and flexible tool than the current generation of smart phones for the mobile business user,” said GIGABYTE Deputy CEO Meng-Ming Ma. “By connecting to Chunghwa Telecom’s broadband wireless network services, users can finally carry a true office-to-go device with them everywhere.”

“The cooperation between VIA, Gigabyte, and Chunghwa Telecom to deliver 3.5G high speed mobile Internet connectivity services with an Ultra Mobile Device gives users unprecedented functionality and connectivity for the new mobile focused lifestyles,” said Feng-Hsiung Chang, Executive Vice President, Chunghwa Telecom Co., Ltd.

Mobility 2.0 Lifestyle

The Mobility 2.0 lifestyle moves people beyond today’s limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at their fingertips through the next generation of Ultra Mobile Devices. Weighing under a kilogram, UMDs are based on the x86 architecture and bridge the gap between the notebook and the mobile phone, bringing the benefits of a PC with all the applications, information and entertainment users require to an ultra portable handheld form factor.

About the GIGABYTE U60

The GIGABYTE U60 Ultra Mobile Device is based on the power efficient VIA C7-M Ultra Mobile Platform and comes with Microsoft Windows Vista Business, Home Premium or Home Basic or Windows XP. Combining a VIA C7-M Ultra Mobile Processor running at speeds up to 1.5GHz and the VIA VX700 system media processor with UniC-Pro II IGP integrated graphics, the GIGABYTE U60 provides powerful computing functionality and a rich multimedia and entertainment experience all in an ultra compact form factor weighing less than 800 grams and delivering long lasting battery life. For more information about the U60 please visit the GIGABYTE website at:
http://www.gigabyte.com.tw/Products/Notebook/Products_Spec.aspx?ProductID=2506

About the VIA C7-M Ultra Mobile Platform

The VIA Ultra Mobile Platform is based on the low power drawing VIA C7-M ULV x86 mobile processor specifically designed for small form factor Ultra Mobile Devices. The VIA C7-M ULV Ultra Mobile Processor utilizes the advanced VIA CoolStream architecture and is manufactured using IBM’s 90nm SOI process for high levels of power efficiency. VIA C7-M ULV processors are available at speeds from 1.0-1.5GHz with a maximum thermal design power (TDP) as low as 3.5 watts, and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a low profile nanoBGA2 package measuring just 21mm x 21mm, enabling designs with drastically reduced weight, size, and thickness. For more details on the VIA C7-M ULV processor, please visit the VIA website at:
www.via.com.tw/en/products/processors/c7-m_ulv/,

Further information on the VIA C7-M Ultra Mobile Platform may be found at:
http://www.via.com.tw/en/products/ultra_mobile/

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw

VIA Technologies, Inc.