Provides rich computing, Internet, and multimedia experience in a light, ultra portable notebook delivering up to five hours of battery life
Taipei, Taiwan, 05 June 2007 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and device platform solutions, will unveil the new VIA NanoBook UMD (Ultra Mobile Device) Reference Design at VTF2007 on 6 June 2007 in Taipei.
Designed to meet the needs of today’s Mobility 2.0 lifestyle, the VIA NanoBook packs the performance, connectivity and functionality of a notebook PC into a sleek and light ultra portable clamshell form factor that weighs less than 850g.
The VIA NanoBook is powered by the ultra low voltage 1.2GHz VIA C7-M processor and delivers up to 5 hours of battery life. Powered by a choice of Microsoft Windows XP or Windows Vista Basic operating systems, it comes with host of advanced features, including a full keyboard, a crisp 7″ WVGA screen with touch panel, up to 1GB DDR2 SDRAM, and a minimum 30GB HDD, as well as 802.11g WiFi, Bluetooth and Ethernet support, plus a DVI and two USB 2.0 ports.
To provide users with additional flexibility when they are on the move, the VIA NanoBook also features a USB slot next to the screen that will enable the snap-in integration of a variety of World Time Clock/Calendar, GPS, VOIP, and broadband wireless modules.
“The VIA NanoBook UMD Reference Design turns my dream of creating a full featured Ultra Mobile Device that delivers a rich computing, communications, and Internet computing experience into a reality,” said Wenchi Chen, President and CEO of VIA Technologies, Inc. “With its highly-functional yet ultra compact form factor and extended battery life, it will enable people to enjoy the Mobility 2.0 lifestyle at any place and any time.”
Recognized Manufacturing Quality
The VIA NanoBook UMD Reference Design has been designed and manufactured in collaboration with First International Computer, Inc (FIC), a world leader in the design and production of computing and other electronics devices, ensuring world class levels of quality and reliability, rapid time to market, and a flexible response to customer needs.
“The unrivaled portability and functionality of the VIA NanoBook makes small screen PDA devices seem hopelessly obsolete,” stated John Villejo, Senior Vice President of Sales and Marketing for FIC. “Users searching beyond cumbersome laptops will also find familiarity with the ergonomics of the VIA NanoBook but with the added benefit of extreme mobility.”
With its innovative design, long battery life, and rich feature set, the VIA NanoBook UMD Reference Design has been adopted as the basis for the forthcoming EasyNote XS from Packard Bell, one of the leading PC brands in the European market.
“The EasyNote XS is a ground breaking new device that combines the functionality of a PC with the convenience of a handheld,” commented Roger Yuen, Asia Pacific Vice President of Packard Bell. “We are very excited about the potential of this new category of Ultra Mobile Devices in the market.”
VIA NanoBook UMD Reference Design
Weighing less than 850g and measuring just 230mm x 171mm x 29.4mm, the VIA NanoBook UMD Reference Design makes all day mobile productivity and entertainment a reality with up to 5 hours of battery life.
Powered by the 1.2GHz VIA C7-M ULV processor and the VIA VX700 chipset featuring the VIA UniC-Pro II IGP integrated graphics core, the VIA NanoBook delivers all the performance and functionality for a rich Windows and Internet experience. Despite its small size, it also comes with a complete set of productivity, multimedia, and connectivity features, including a full keyboard, a 7″ WVGA screen with touch panel supporting 840×480 resolution, up to 1GB DDR2 SDRAM, a 30/60GB HDD, and a 4-in-1 card reader, as well as 802.11g WiFi and Bluetooth support, plus an Ethernet, a DVI and two USB2.0 ports plus Mic-In/Speaker-Out ports. The device supports Microsoft Windows XP and Windows Vista.
To further extend the device’s functionality, the VIA NanoBook is also equipped with a USB slot next to the screen that can be configured to include a World Time Clock, GPS, DVB, VoIP or even 3G/CDMA wireless broadband modules. The standard model has a smart silver finish, though greater personalization is possible with a variety of shell colour options.
Targeted at aggressive consumer price points, the VIA NanoBook is ideally suited to the consumer, business and education markets and versions of it will be available through leading global OEMs and SIs in the second half of 2007. For the full VIA NanoBook UMD Reference Design specification, please visit the VIA website here:
Mobility 2.0 moves people beyond today’s limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at their fingertips through the next generation of Ultra Mobile Devices. Weighing under a kilogram, UMDs are based on the x86 architecture and bridge the gap between the notebook and the mobile phone, bringing the benefits of a PC with all the applications, information and entertainment users require to an ultra portable form factor.
About the VIA C7-M Ultra Mobile Platform
The VIA Ultra Mobile Platform is based on the low power drawing VIA C7-M ULV x86 mobile processor specifically designed for small form factor Ultra Mobile Devices. The VIA C7-M ULV Ultra Mobile Processor utilizes advanced VIA CoolStream architecture and is manufactured using IBM’s 90nm SOI process for high levels of power efficiency. VIA C7-M ULV processors are available at speeds from 1.0-1.5GHz with a maximum thermal design power (TDP) as low as 3.5 watts, and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a low profile nanoBGA2 package measuring just 21mm x 21mm, enabling designs with drastically reduced weight, size, and thickness. For more details on the VIA C7-M ULV processor, please visit the VIA website at:
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw