VIA CEO Wenchi Chen showcases new VIA NanoBook UMD Reference Design for driving the ultra mobile lifestyle, and Mobile-ITX mainboard prototype for next generation convergence of computing and communications
Taipei, Taiwan, 6 June 2007 – Wenchi Chen, President and CEO of VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today outlined the move towards and the key elements of PC2.0, showcasing the latest innovations from VIA, such as the VIA NanoBook UMD Reference Design and a prototype of the Mobile-ITX mainboard that will drive this transition
“Moving beyond the traditional desktop PCs and notebooks of the PC1.0 era, there is an eruption of form factor, application and service innovation, out of which a new generation of devices is emerging that we call PC2.0, which are more accessible, more convenient and more connected than ever before,” commented Wenchi Chen, President and CEO of VIA Technologies, Inc. “The main areas experiencing this rapid growth are in connected clients for the home as well as the enterprise, emerging market devices, green technology, and, of course, the exciting young field of ultra mobile devices.”
Enabling this transition are the proliferation of ubiquitous intelligence and broadband access, as well as exponential innovation on the hardware side from providers such as VIA and its customers, and the provision of richer content and applications and innovative services. On the hardware side, VIA’s leadership in miniaturization, power efficiency, rich digital media integration and full x86 compatibility gave it a strong edge on providing the platforms to help drive the transition, as they enable the smaller, lighter, quieter, more energy efficient, more portable and more affordable devices required.
“VIA has long held the industry leadership in shrinking the platform size, at both the silicon and platform level, and we’re continuing to do so – the Pico-ITX mainboard, the world’s smallest complete x86 mainboard at 10cm x 7.2cm, is the most recent and is now selling well, but it doesn’t stop there,” said Chen.
VIA Mobile-ITX Mainboard Prototype: the True Convergence Platform
Chen then showed the Mobile-ITX, a tiny mainboard smaller than a standard business card that contains not only all the silicon to run full x86 PC applications but also a CDMA chip, all on a platform compact and thin enough to fit within a mobile phone. This prototype board, at just 75mm x 45mm, underlines VIA’s expertise in designing for power efficiency and integration.
“This prototype Mobile-ITX gives a glimpse into the future of ultra mobile devices and the real convergence of computing and communications,” continued Chen. “Yet this is only the start. We see the platform shrinking still further, with ever richer blends of functionality, that will truly make ultra mobility the normal way of enjoying our content and our communications.”
VIA NanoBook UMD Reference Design to Drive Ultra Mobility
Ultra mobility is one of the most exciting and fast-emerging new markets to emerge over the last two years, with the neighbouring Computex Taipei 2007 exhibition displaying many ultra mobile devices (UMDs) aimed at making your world portable. The VIA Ultra Mobile Platform, comprising one of the ultra power efficient VIA C7-M processors and mobile digital media chipsets, is powering many of these devices thanks to its full x86 performance for an uncompromised Internet and digital media performance with a remarkably low power draw for enhanced battery life.
The VIA Ultra Mobile Platform, which won “Best IC” design at the Computex Taipei show this year, powers the OQO model O2 device, which was demonstrated running a video on-stage, and also the recently announced VIA NanoBook UMD Reference Design, an ultra portable clamshell form factor UMD designed for business and personal users. The VIA NanoBook was demonstrated during the keynote, with the first customer, Packard Bell, also on hand to talk about it during a later keynote.
Partnering for PC2.0
In order to achieve PC2.0, silicon platform developers, device manufacturers, application software developers, content and broadband service providers would need to work more closely together to ensure a smoother transition. At this point, Chen introduced Mr Shiao-Tung Chang, VP at Chunghwa Telecom, with whom VIA and Gigabyte recently announced a three-way strategic alliance. Mr Chang re-emphasized the necessity of partnership for the success of the ultra mobile lifestyle, and revealed that the Gigabyte device at the heart of the alliance, the U60, had sold out within 20 minutes of the offer opening this month. He also outlined the progress of Chunghwa Telecom in connecting the whole of the country for 3.5G service, and how the collaboration between the three parties was one which the rest of the industry providers should follow.
About the VIA Technology Forum 2007
VTF2007, the eighth annual VIA Technology Forum, will be held at the Grand Hyatt Taipei Hotel on Wednesday 6 June 2007, alongside the Computex trade show. The VIA Technology Forum has firmly established itself as one of the most prominent technology events on the industry’s global calendar, highlighting the principal strategies of VIA and partners and defining key industry trends. This year’s theme is “Ultra Mobility”, a principal element of VIA’s “Small is Beautiful” philosophy, and represents VIA’s strategy to drive the x86 platform into ever smaller and more portable form factors. For more information on the VIA Technology Forum, please visit our VTF2007 website at: www.via.com.tw/vtf/
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw