Experience the very latest in miniaturized, ultra power-efficient embedded platforms with VIA at ESEC Embedded Systems Expo 2008
Taipei, Taiwan, May 13th 2008 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at ESEC Embedded Systems Expo, on May 14-16, Japan, Tokyo, showcasing highly-integrated x86 platforms designed specifically for embedded system developers.
Join VIA at Booth 26-30 East and experience remarkable advances in power-efficiency and miniaturization. On display you’ll find the latest additions to the VIA EPIA range of ultra compact, full-featured embedded boards as well as segment specific boards and complete system solutions.
A full system in the palm of your hand, the latest VIA EPIA Pico-ITX board will be on display featuring the unrivalled thermal and power efficiency of the incredible 500MHz VIA Eden ULV processor, joining a comprehensive selection of feature-rich VIA EPIA Mini-ITX boards and the latest segment specific boards for thin server, security and gaming applications, including the recently announced VIA NAS 7800 and VIA NAB 7500 boards.
Complete systems will be displayed including the VIA vmpc, an innovative digital signage solution that uses a unique thru-chassis design to turn any video display into a complete digital signage system in moments. Attendees can also see the popular VIA ARTiGO Builder Kit featuring the VIA EPIA PX10000G Pico-ITX board and a compact user-friendly chassis.
Visitors can experience the latest in embedded multimedia applications with the VIA VX800 all-in-one digital media IGP chipset and the power-efficient high performance 3D graphics and HD video/audio acceleration of the latest embedded graphics processor from S3 Graphics.
“VIA is honored to attend the most important embedded systems conference in Asia,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “VIA prides itself in delivering to market products that exceed the expectations of embedded system developers in terms of both miniaturization and thermal and power efficiency.”
More information about VIA’s participation at the ESEC Embedded Systems Expo may be found at:
About ESEC Embedded Systems Expo 2008
The 11th ESEC Embedded Systems EXPO promises to build on the success of the previous year’s event which attracted a record number of exhibitors and visitors, securing the ESEC’s reputation as the most important embedded conference in the Asia Pacific area. http://www.esec.jp/en/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw