VIA receives Computex Taipei design and innovation award for pioneering innovation in the development of ultra-mobile mini-notes
Taipei, Taiwan, 2 June 2008 – VIA Technologies, Inc, a leading innovator of ultra-mobile, power efficient x86 processor platforms, proudly announced today that the VIA OpenBook mini-note reference design has won the impressive Computex Taipei design and innovation Gold Award for 2008.
Event organizers Computex Taipei and the Taiwan Design Center selected iF International Forum Design GmbH to preside over the award ceremony, with an international jury comprising experts in industrial design judging the entries on the basis of their technology, innovation, design and international sales potential.
“VIA is extremely pleased to receive this prestigious award for design and innovation,” commented Richard Brown, Vice President of Marketing, VIA Technologies, Inc. “It certainly validates our efforts to take the VIA OpenBook to the next level of style and customization.”
VIA has brought a unique “open” approach to the individualization and customization of the VIA OpenBook mini-note reference design by making the CAD files of the external panels for the VIA OpenBook available for download directly from the dedicated website: www.viaopenbook.com.
The mini-note market is the fastest growing segment of the mobile PC industry, and the VIA OpenBook ushers in the next generation of mini-note designs. Powered by VIA’s ultra-mobile processor platform, comprising the VIA C7®-M ULV processor paired with the VIA VX800 unified digital media IGP chipset, the VIA ultra mobile platform brings fans of the mini-note revolution unrivalled broadband connectivity, superior video and audio playback and stunning graphics, all packaged in a sleek, highly portable, clamshell form factor.
Where to See the VIA OpenBook Mini-Note Reference Design
For those of you lucky enough to be in Taipei this week drop by the VIA hospitality suite, room 201D in the Taipei International Convention Center, for a first-hand look and feel of this new generation of mini-note devices. The VIA OpenBook mini-note reference design will also be on show in Microsoft’s mini-note display on their booth G236 located in Hall 3 of the Taipei World Trade Center.
Click here to watch a video of the VIA OpenBook being put through its paces by Richard Brown, VP of Marketing, on the open roads of sunny California.
For more on VIA’s participation at Computex Taipei 2008, please visit the VIA website at:
About the VIA OpenBook Mini-Note Reference Design
Powered by the VIA C7-M ULV processor and the VIA VX800 digital media IGP chipset, the VIA OpenBook mini-note reference design is a small, 1kg, 8.9″ mini-notebook form factor design that supports screen resolutions of up to 1024×600 and high performance VIA C-9 DirectX™ 9.0 3D graphics. Advanced video acceleration for MPEG-2, MPEG-4, WMV9 and VC1 video formats, a VMR capable HD video processor and 8-channel HD audio make it a highly media rich mini-notebook platform.
The VIA OpenBook mini-note reference design offers unrivaled broadband connectivity options though two internal modules, with the first one featuring WiFi, Bluetooth, and optional AGPS connections and the second one offering a choice of WiMAX, HSDPA, or EV-DO/W-CDMA options. In addition, the VIA OpenBook also comes with three USB 2.0 ports, a VGA port, and audio-in/audio-out jacks as well as a 4-in-1 card reader (SD/SDIO/MMC/MS) and a 2 mega-pixel dual-headed web camera.
The VIA OpenBook supports a wide range of operating system environments, including Microsoft Windows Vista Basic, Microsoft Windows XP, and various Linux distributions. The device features up to 2GB DDR2 DRAM and can be equipped with a choice of hard disk drive and solid state storage options.
For more information, file downloads, video and images of the VIA OpenBook mini-note reference design, please visit the VIA OpenBook website: www.viaopenbook.com
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw