VIA Nano Processor Platform Wins WinHEC Award 2008 for Green Technology

Ultra power efficient, lead and halogen-free VIA Nano processor and VIA VX800 unified digital media IGP chipset recognized for contribution to green computing

WinHEC, Taipei, Taiwan, 10 December 2008 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the VIA Nano processor and the VIA VX800 unified digital media IGP chipset received an Excellent Product Award at WinHEC 2008 in Taipei this week.

Presented by Taiwan’s Vice President, Vincent Siew, the award recognized VIA’s efforts to reduce energy consumption and use of hazardous manufacturing materials of the VIA Nano processor platform, and to facilitate ease of recycling.

“Very early on, VIA opted to take an approach to product design that factored in what impact its products and processes have on the environment,” said Epan Wu, Director of CPU Product Marketing, VIA Technologies, Inc. “While we are delighted to receive this award for our VIA Nano processor platform, even more satisfying is noting the IT industry’s growing awareness of environmental issues and its increasingly pro-active approach.”

A video of the presentation ceremony, as well as a look at VIA’s booth at WinHEC 2008, can be viewed at:http://www.youtube.com/watch?v=2l_ox-Na12Y

Innovative, power efficient new products featuring the VIA Nano processor platform will be showcased at VIA’s annual Lunch@Piero’s media event, held on the 8th and 9th of January at Piero’s Restaurant opposite the Las Vegas Convention Center, during CES 2009. For more information, please visit the VIA website at:
http://www.via.com.tw/en/company/events/ces2009/index.jsp

About the VIA Nano Processor Family

The first 64-bit, superscalar processors in VIA’s x86 platform portfolio, VIA Nano processors have been specifically designed to revitalize traditional desktop and notebook PC markets, delivering truly optimized performance for the most demanding computing, entertainment and connectivity applications.

The VIA Nano processor family leverages advanced 65 nanometer process technology for enhanced power efficiency, and augments that with aggressive power and thermal management features within the compact 21mm x 21mm nanoBGA2 package for an idle power as low as 100mW (0.1W), extending the reach of power efficient green and silent PCs, thin and light notebooks and mini-notes around the world. For further information on the VIA Nano processor family, please visit the VIA website at: http://www.viatech.com/Nano

About the VIA VX800 Unified Digital Media IGP Chipset

The VIA VX800 is an all-in-one media system processor that integrates all the cutting-edge features of a modern chipset’s North and South bridges into a single package measuring just 33mm x 33mm, generating a silicon real estate saving of over 42% over traditional twin-chip core logic implementations.

Targeted at small form factor green PCs, thin ‘n’ light notebooks, ultra mobile mini-notes and high performance embedded systems, the VIA VX800 strictly adheres to VIA’s stringent power efficiency design parameters, such that complete processor platform power draw can be limited to as low as 7.5 watts. For further information and full specifications, please visit the VIA website at: http://www.via.com.tw/en/products/chipsets/v-series/vx800/

About WinHEC

WinHEC (Windows Hardware Engineering Conference) is the only Microsoft conference that is exclusively focused on designing PCs, servers, and devices that run and interface with Windows. A global event, this year’s conference locations include Los Angeles, Beijing and Tokyo, with the Taipei leg spanning December 9th and 10th at the Taipei International Convention Center.
http://www.microsoft.com/whdc/winhec/default.mspx

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

VIA Technologies, Inc.