VIA-Developed Pico-ITXe Claims Center Stage at Computex 2009

Pico-ITXe form factor wins ‘Best Choice of Computex Taipei 2009 Award’

Taipei, Taiwan, 26 May 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the recently launched Pico-ITXe form factor received the coveted ‘Best of Computex’ award by the Taiwan Computer Association and the Taiwan External Trade Council (TAITRA), during a ceremony today.

Developed in collaboration with the Small Form Factor Special Interest Group (SFF-SIG), the Pico-ITXe form factor utilizes SUMITTM connectors for additional modular I/O, offering developers more flexible and cost-effective design options for compact embedded systems. The Pico-ITXe specification means that designing next generation embedded devices is as simple, expedient and rational as possible.

“VIA has continually sought to deliver ground-breaking form factor designs that make compact, flexible system design easier than ever before,” said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. “Pico-ITXe has helped transform the small form factor landscape, with many key industry players producing compatible Pico-IO modules.”

About the Pico-ITXe Form Factor

Pico-ITXe is an open, multi-sourced standard based on the VIA-developed Pico-ITX form factor. Using the same 10cm x 7.2cm dimensions as Pico-ITX, the Pico-ITXe specification includes unique fixed mounting holes and unique SUMIT connectors to allow easy development of stackable, I/O-centric embedded devices using advanced serial bus technology.

Products based on the Pico-ITXe specification act as the perfect base board, taking advantage of an intelligent board layout that greatly aids both heat dissipation and stackability, all within a remarkably small footprint. The VIA processor platform compliments the Pico-ITXe specification, offering a diverse array of legacy and next generation features.

SUMIT connectors are used to interface between base board and I/O expansion boards allowing simple connection of PCI Express, LPC, SPI and USB 2.0 buses across as many as four stacked layers.

For more information about Pico-ITXe form factor, please visit:
http://www.via.com.tw/en/initiatives/spearhead/pico-itxe/index.jsp

The VIA EPIA-P710

The VIA EPIA-P710 is the very first board to take advantage of the new Pico-ITXe form factor and SUMIT connector specifications. The compact VIA EPIA-P710 is powered by a 1GHz VIA C7 The VIA EPIA-P710 is the very first board to take advantage of the new Pico-ITXe form factor and SUMIT connector specifications. The compact VIA EPIA-P710 is powered by a 1GHz VIA C7 processor and the VIA VX800 media system processor offering a full feature set and incredibly versatility that makes it perfect for a range of embedded applications.

More information about the VIA EPIA-P710 can be found here:
http://www.via.com.tw/en/products/embedded/ProductDetail.jsp?productLine=1&motherboard_id=730

VIA EPIA-P710 Industry Adoption and Momentum

The VIA EPIA-P710 has seen significant industry acceptance since its announcement, with a number of Pico-IO expansion cards now available on the market from key industry players including Access I/O Products, Inc and WinSytems.

VIA Embedded at Computex 2009

Join VIA at Computex 2009, Nangang Exhibition Hall, Booth L409A and experience a range of innovative small form factor boards and systems as well as new system level design manufacturing services from VIA.

Visitors will be able to see the VIA EPIA P710 board, the first product on the market to feature the new Pico-ITXe form factor.

For more information about VIA Embedded at Computex 2009 please visit:
http://www.via.com.tw/en/company/events/computex2009/index.jsp

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

VIA Technologies, Inc.