VIA Unveils ‘GMB for Life’ Theme at VIA GMB Tech Forum Summer

Over 400 industry leaders and VIA GMB Alliance partners gather to layout the blueprint for continued rapid growth in the mini-note device market

Taipei, Taiwan, 25 June 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Global Mobility Bazaar (GMB) Tech Forum Summer, which was held earlier this afternoon at the Crowne Plaza Hotel in Shenzhen, China.

Building on the success of the VIA GMB Tech Forum Spring event in mid-March this year, the VIA GMB Tech Forum Summer again brought together a host of PC manufacturing and infrastructure partners, as well as leading players from the telecommunication industry, all focused on delivering affordable, power efficient mini-notebooks to global markets. Over 400 participants listened to expert analysis of mini-note device segment trends and future potential, with particular emphasis paid to the importance of 3G integration and applications.

With component partners including leading vendors such as American Megatrends (AMI), InnoLux, ITE Tech, PQI, SanDisk and TD Hi-Tech already onboard, the VIA GMB Alliance has recently added leading Chinese IT service provider, Bluex, to its membership in order to offer after-sales service solutions for all certified devices manufactured by Alliance members.

This comprehensive end-to-end service gives rise to the ‘GMB for Life’ theme of today’s event, and reflects the Alliance’s ability to assist group members in providing products that can deliver the full benefits of a connected consumer lifestyle including online health services and free communications tools, along with a myriad of entertainment options.

“The mission of the VIA GMB Alliance is to link the complex chain of hardware and software vendors, manufacturers, distributors, retailers and service providers that make up the mini-notebook market ecosystem,” said Kevin YC Huang, Chairman of the VIA GMB Alliance. “By doing this we create an environment where the ‘GMB for Life’ philosophy can flourish and inspire innovative devices that place the needs of the consumer first.”

About the VIA GMB Alliance

Launched in Shenzhen, China, in October 2008, the VIA Global Mobility Bazaar Alliance was established as part of VIA’s long-term commitment to inspire innovation in mobile computing devices by sharing its leading-edge technology and expertise in power efficient x86 processor platforms.

More than 20 leading Chinese manufacturers are participating in the VIA Global Mobility Bazaar, as well as infrastructure partners American Megatrends (AMI), InnoLux, ITE Tech, PQI, SanDisk, TD Hi-Tech, and leading IT after-sales service provider, Bluex.

A key focus of the VIA GMB Alliance is to bring innovative mobile computing devices such as mini-notebooks to fast-emerging markets around the world, as well as within China. These markets are among the fastest growing in the world and are developing a keen appetite for mobile computing.

About VIA Ultra Mobile Platforms

VIA Ultra Mobile Platforms are centered on ultra power efficient mobile processors, such as the VIA Nano and VIA C7-M processors, which help ensure longer battery life with great media playback. Coupled with low power, full featured chipsets integrating advanced graphics processors, VIA Ultra Mobile Platforms provide support for brilliant 2D/3D graphics, while the VIA C-Motion video display engine offers a stunning video experience. A top choice for ultra mobile devices, VIA Ultra Mobile Platforms power over 30 global design wins on the market today.

For more details on the VIA Ultra Mobile Platforms, please visit the VIA website at:
http://www.via.com.tw/en/products/ultra_mobile/

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

VIA Technologies, Inc.