VIA Sponsors First TechNode Collide: Powering the China Cloud

Brings together leading visionaries and entrepreneurs from China

Taipei, Taiwan, 19 May, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will be the main sponsor of the first TechNode Collide Conference taking place in Beijing on 25 May 2011.

Based on the theme of Powering the China Cloud, TechNode Collide attendees will discuss the next wave of cloud innovation in devices, applications, and services and their impact on China and beyond in a lively, interactive format.

In addition to keynote presentations, the event includes three tracks covering the latest developments in Cloud Computing, the Mobile Cloud, and Smart TV featuring speakers and panelists from a host of leading companies, including HTC, Lenovo, PayPal China, Comsenz, 3G.cn, Shanda Cloud Computing, SkyCloud, CSDN, VIA Telecom, Jiepang, RenRen, K-Touch, Best TV, China Broadband Capital, Orange, and Technicolor China.

The event will conclude with a unique Start Up Jam session in which representatives of China’s most exciting new hi-tech start-ups will present their business plans, including Everbox, Suishouji (mobile finance), Shanda Note (cloud storage), Camera360 (mobile image sharing), UMeng (reporting system), Hozom (social contact), and Senscape (Augmented Reality).

“We are delighted to be sponsoring the first TechNode Collide Conference,” commented Richard Brown, Vice President of Marketing, VIA Technologies, Inc. “Cloud based innovation is happening at an explosive rate in China, and this event gives us the perfect opportunity to showcase our innovative technologies and products that are driving the latest developments in this burgeoning marketplace.”

“With a host of high-level speakers and panelists from the industry’s leading services, hardware, and software players, the TechNode Collide Conference promises to be a truly enlightening event,” commented Dr. Gang Lu, Founder & Chief-Editor of TechNode.com. “It will give attendees an unrivaled understanding of the plethora of opportunities being powered by the emergence of the China Cloud.”

About TechNode Collide

TechNode Collide takes place on Wednesday 25 May from 1:00 to 9:00pm at Tangguo, next to the Tonghegong Lama Temple, Beijing. The preliminary schedule is as follows:

12:00 – 1:00 Doors open
1:00 – 1:10 Opening speech
1:10 – 1:30 Keynote Ray Yam, Head of HTC China
1:30 – 1:50 Keynote David Wei, Vice President, R&T Executive Director, GM of Mobile Internet Lab and Digital Life Lab, Lenovo
2:00 – 3:00
Cloud Computing Track
  • James Eron, COO ChinaNetCloud
  • Michael Zhao, Head of Integration Service, Paypal China
  • Kevin Day, CEO of Comsenz (Tencent)
  • Cao Ming, VP of 3G.cn
  • Zheng Jisheng, Shanda Cloud Computing, Everbox
3:00 – 4:00
Mobile Cloud Track
  • Liu Jiang, Chief-editor of CSDN
  • Zheng Lie, COO, VIA Telecom
  • Yang Yuancheng, Co-founder, Jiepang
  • Huang Jing, Head of Product Marketing, RenRen
4:00 – 4:15 Break
4:15 – 4:30 VIA Presentation
4:30 – 5:15
Smart TV Track
  • Kevin Rui, VP, Best TV
  • Wang Haila, CEO of Orange France Beijing
  • Yang Jin, Senior VP of Technicolor China
Start-Up Jam
5:15 – 6:30 Start Up Presentations
  • Everbox (cloud storage & sync service)
  • Suishouji (mobile finance)
  • Shanda Note (cloud storage)
  • Camera360 (mobile image sharing)
  • UMeng (reporting system)
  • Hozom (social contact)
  • Senscape (Augmented Reality)
  • YuanOS (cloud OS)
7:00 VIP Dinner & Party (Invitation Only)

For more information, please click here:
http://technode.com/2011/05/15/technode-presents-collide-powering-the-china-cloud-conference-may-25th/

Tickets to the event cost 200RMB. For registration details, please click here:
http://technode.51qiangzuo.com/.

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA,s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world,s top OEMs and system integrators. www.via.com.tw

VIA Technologies, Inc.