Come Explore the VIA Smart Ecosystem at Computex 2012

VIA to demonstrate a wide range of next generation Smart Solutions for a truly interconnected world

Taipei, Taiwan, 9th May, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly interconnected world. Join VIA at Computex 2012, 4F Nangang Exhibition Hall, Booth MO311.

Along with VIA Smart Ecosystem solutions, visitors to Computex 2012 will be able to learn about the VIA Smart Ecosystem buildings blocks which will include a full array of VIA’s industry leading x86 multi-core and ARM based platforms, state of the art audio and USB 3.0 solutions, and Android support for both ARM and x86. Come discover how the VIA Smart Building blocks are utilized for an almost unlimited range of PC, mobile, and embedded system design applications.

“VIA is excited to participate in this years Computex 2012 and to welcome visitors to learn about the VIA Smart Ecosystem,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “The VIA booth will offer a wealth of inspiration for visitors looking for innovative “Smart” solutions for today’s interconnected world.”

VIA Smart Solutions

Utilizing the VIA Smart building blocks, a wide range of Smart Solution scenarios will be on display within the VIA booth at Computex 2012, including:

  • Smart Business
  • Smart Connectivity
  • Smart Development
  • Smart Education
  • Smart Entertainment
  • Smart Healthcare
  • Smart Hospitality
  • Smart Travel
  • Smart Signage

For more detailed information about VIA’s involvement at Computex 2012, please visit:
http://www.via.com.tw/en/company/events/computex2012/index.jsp

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

VIA PR Contact

Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886)-2-8218-6752
Email: RIBrown@via.com.tw
VIA Technologies, Inc.