APC Paper breaks the mold of traditional PC design using new materials and a distinctive new form factor
Taipei, Taiwan, 1 June, 2013 – today announced that APC Paper received a coveted Computex 2013 d&i (design and innovation) award presented by the Taiwan External Trade Council (TAITRA) in cooperation with the International Forum Design Hannover (iF), during a ceremony today.
APC Paper was awarded this prestigious honor for its groundbreaking use of new types of materials and form factor which pushes the boundaries of PC design in new directions. With special attention to an organic design, the cardboard encased APC Paper blends seamlessly into any home or office environment.
“We are delighted to have received this prestigious award,” said Richard Brown, VP of International Marketing, VIA Technologies, Inc. “This validates our vision of breaking the mold of traditional PC design using more environmentally-friendly materials and distinctive new form factors.”
APC Paper, with its unique recycled cardboard case, is based on the Neo-ITX form factor which measures 17cm x 8cm. APC paper integrates memory, storage, and a full set of consumer I/O features in a small footprint Neo-ITX motherboard that can be connected to a TV or monitor. The system also features a custom build of Android 4.0 that has been optimized for keyboard and mouse input, and comes with a browser and a selection of preinstalled apps. APC Paper will be available early in Q3.
For more information about APC please visit: apc.io
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APC was born from our love of computers and our realization that the PC needs a fundamental redesign. The redesign that we offer is a computer that is more accessible, and more valuable, because you’re not paying for functions that you don’t need and won’t be using. With its small form factor, low power consumption, and customized version of the world’s most popular smart phone operating system, we’ve designed APC to be a bicycle for your mind, enabling ever more people to access to the Internet and opening up exciting opportunities for innovation on the platform. apc.io
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw