VIA AMOS-820 delivers extreme power efficiency with rich connectivity including 3G and legacy I/O support, in a fanless, ruggedized system
Taipei, Taiwan, 3 December, 2013 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-820, an ultra-compact, fanless system designed around the tiny VIA VAB-820 Pico-ITX board. The VIA AMOS-820 provides embedded customers with a ruggedized system that delivers advanced processing power in an extremely power efficient design for a diversified range of industrial automation, transportation, HMI, and energy management applications.
Featuring a 1.0GHz Freescale i.MX6Quad ARM Cortex-A9 SoC with three integrated GPUs, the VIA AMOS-820 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -20°C up to 65°C, the VIA AMOS-820 delivers a typical power consumption of a mere 7W TDP and offers support for Embedded Linux, Windows Embedded Compact 7 (WEC 7), and Android operating systems. Featuring capture-in support and optional 3G connectivity, the VIA VAB-820 is also ideal for surveillance and features PoE (Power over Ethernet) support for seamless integration.
“The VIA AMOS-820 further extends our market leadership in ruggedized ARM-based embedded systems,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The combination of quad core processing and ultra-low power consumption provides an exciting combination for customers to create innovative compact connected devices.”
The VIA AMOS-820 combines a 1.0GHz Freescale i.MX6Quad ARM Cortex-A9 SoC with three independent, integrated GPUs, creating a completely fanless system for even the most computing-intensive of environments within a robust chassis measuring 15cm x 4.6cm x 10.8cm (W x H x D).
On-board storage includes 4GB of eMMC Flash and can be expanded through one MicroSD card slot. Comprehensive I/O functions on the front and rear panels make the VIA AMOS-820 a flexible solution for a wide range of embedded applications. Front I/O includes two COM ports, one DIO port, two CAN ports, one USB 2.0 port and one Micro USB 2.0 OTG port as well as Line-in/out and Mic-in, while rear I/O includes one HDMI port, one composite RCA jack, one GigaLAN port, one MicroSD slot and two USB 2.0 ports. Optional 3G/WiFi is available which can be supported through on-board USB pin-headers or Mini PCIe slot.
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About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
VIA PR Contact
Richard Brown Phone: (886)-2-2218-5452 #6201 Fax: (886)-2-8218-6752 Email: RIBrown@via.com.tw