VIA Launches VIA QSM-8Q60 Qseven™ Module

Low-power, ultra-compact form factor accelerates time-to-market for highly-customized embedded and enterprise-grade IoT systems

Taipei, Taiwan, 22 September, 2015 – VIA Technologies, Inc today announced the launch of the VIA QSM-8Q60 Qseven™ form factor module powered by a 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC. Combining advanced multimedia performance with a rich array of I/O features in a low power, ultra-compact package, the module is ideal for a wide range of applications such as industrial automation, transportation, medical, and infotainment.

The VIA QSM-8Q60 module measures just 70mm x 70mm and is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). This modular design approach allows for short time-to-market, application-specific customization, high stability, and long life cycles for customers developing enterprise-grade IoT and embedded systems.

“The explosive growth of the Internet of Things is leading to growing demand for highly-customized systems targeted at a plethora of commercial IoT applications,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “With its modular low power design and comprehensive BSP and software support services, the VIA QSM-8Q60 addresses this need by minimizing development costs and accelerating the time-to-market.”

VIA QSM-8Q60

In addition to its 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC, the VIA QSM-8Q60 features an on-board Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3-10666 SDRAM. To provide customers with optimum system design flexibility, the module also offers a rich array of I/O and display expansion options, including four USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, two COM ports, Gigabit Ethernet, CAN bus and PCIe x1. Support for a wide operating temperature of -20°C ~70°C ensures rock-solid reliability in even the harshest operating environments.

Customers can take advantage of the VIA QSMBD2 multi-I/O evaluation carrier board for system development or can utilize the company’s extensive technical support to create a custom baseboard.

The VIA QSM-8Q60 features a Linux BSP which includes the kernel (3.0.35) and bootloader source codes. Other features include a Tool Chain to help make adjustments to the kernel and to support the VIA QSMBD2 carrier board I/O and other hardware features. A full set of software customization services that speed up time to market and minimize development costs is also available.

 Availability

 Samples of the VIA QSM-8Q60 Qseven™ form factor module are available at the time of this release.

For more information about the VIA QSM-8Q60, please visit: http://www.viatech.com/en/boards/modules/qsm-8q60/

For images related to this release, please visit: http://www.viagallery.com/via-products/via-embedded-system-on-modules/via-QSM-8Q60-qseven-module/

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com

VIA Technologies, Inc.