Latest Innovations from VIA at Embedded World 2016

embedded-world-2016

If you are planning to visit Embedded World this week, please feel free to stop by at the VIA Booth at 4A-251 in Hall 4 of the Nuremberg Exhibition Centre to see our latest Enterprise IoT and Mobile360 innovations.

For those of you who are not at the show, we plan to post a series of updates. Here is a taster of just some of the highlights:

    • 360 Surround ViewVIA Mobile360 In-Vehicle Surround View Fleet Management SystemUtilizing VIA Multi-Stitch technology, the system can seamlessly combine up to 6 camera feeds on the fly to create an encompassing 360° view from a vehicle that can be viewed locally or remotely – providing the ultimate solution for monitoring, security, and tracking.

 

    • VIA Mobile360 HMI Starter Kits: VIA Mobile360 HMI Starter Kits combine a highly-integrated low-power motherboard with a choice of validated LCD screens to provide the fastest and smoothest path for building a host of Android- and Linux-based all-in-one smart display devices for a wide variety of in-vehicle infotainment and digital signage applications.

 

  • VIA ETX-8X90-10GR Module: Harnessing the ultra low power consumption and advanced performance of the new VIA Eden® X1 processor, this flexible new module provides a powerful upgrade for systems currently featuring end-of-life processor modules while maintaining full legacy software support.

  • VIA Alegro 100 Smart Home Automation System: With its support for Bluetooth, Wi-Fi, ZigBee, Z-Wave, and KNX-RF, this multi-protocol home gateway device provides a flexible solution for a host of smart home automation applications and can be customized to meet your exact requirements.

If you would like to get a free pass for Embedded World, please register with the code B318992 at www.embedded-world.de/voucher. For more detailed information about the products we have on display, please feel free to download our new 2016-2017 Product Guide!

VIA Technologies, Inc.