Co-Creation Success Stories @ ESEC 2016

VIA_Booth_ESEC_2016

The Embedded Systems Expo Conference (ESEC) ran from May 11th-13th as part of Japan’s IT week. This year, the VIA booth featured a wide range of Enterprise IoT solutions with a number of live demos targeted at transportation applications on display.

We were impressed by the great interest from the crowd and enjoyed many stimulating conversations on the subjects ranging from route planning and tracking, in-vehicle driver support systems, to accident analysis for transportation and logistics markets, which will surely develop into fruitful cooperation in the near future.

Highlights from our booth: VIA Mobile360 Surround View System, Ubiquitous Quickboot for the VIA VAB-820 and Mitsui In-Vehicle Remote Monitoring Solution based on the VIA AMOS-820
Highlights from our booth: VIA Mobile360 Surround View System, Ubiquitous Quickboot for the VIA VAB-820 and Mitsui In-Vehicle Remote Monitoring Solution based on the VIA AMOS-820

The visitors to out booth were in particular impressed with our capability to provide total solutions including hardware and software customization, fine-tuned to accommodate our clients’ particular requirements.

If you are interested in co-creating a new solution with us, don’t hesitate to contact us today. Find out more about hardware engineering and software customization services we offer in order to accelerate your customized system deployment.

If you would like to see more images from the show, please visit our VIA Gallery.

VIA Technologies, Inc.