VIA Enhances Graphics and Video Performance of VIA AMOS-820 Enterprise IoT System


NXP i.MX 6QuadPlus Cortex-A9 SoC and Android 6.0 BSP now available for multimedia-rich HMI applications

Taipei, Taiwan, 13 September, 2016 – VIA Technologies, Inc. today announced the availability of a refresh of its VIA AMOS-820 Enterprise IoT system featuring the NXP i.MX 6QuadPlus ARM® Cortex®-A9 Core SoC. With its higher graphics and memory performance, the system provides an ideal solution for multimedia-rich HMI applications across a broad range of industrial, energy management, medical, and in-vehicle applications.

Refreshes of the VIA VAB-820 Single-Board-Computer and VIA QSM-8Q60 QSeven™ Module featuring the NXP i.MX 6QuadPlus ARM® Cortex®-A9 Core SoC are also available. All three platforms come with a choice of Android 6.0 and Linux BSPs to facilitate software development, a wide operating temperature range of -20°C ~ 70°C, and 7-year longevity support.

“The performance boost offered by the NXP i.MX 6QuadPlus SoC allows our most popular Enterprise IoT platforms to enhance the generation and display of critical real-time data in rich visual formats,” said Richard Brown, Vice President of International Marketing, VIA Technologies, Inc. “Customers can leverage our extensive experience in customizing both the hardware and software of these platforms to dramatically shorten the time-to-market for their application-specific solution.”


The VIA AMOS-820 is a rugged, fanless, ultra-reliable system supporting dual CAN bus and COM ports along with rich wireless connectivity options. A Power over Ethernet (PoE) option is also available.

For more information about the VIA AMOS-820, please visit:


Based on the ultra-compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-820 is a proven development platform for new Enterprise IoT devices. Customers can take advantage of our extensive software and hardware development expertise for the rapid customization of their application-specific system designs.

For more information about the VIA VAB-820, please visit:


The VIA QSM-8Q60 module measures just 70mm x 70mm and is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard. Customers can utilize the VIA QSMBD2 multi-I/O evaluation carrier board for system development or can work with us to create a custom baseboard.

For more information about the VIA QSM-8Q60, please visit:

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About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.

VIA Technologies, Inc.