ESEC 2017

Join us in Booth #W1-26 of the Japan IT Week Embedded System Expo (ESEC), being held from May 10th – 12th, in Tokyo Big Sight, Japan, to experience our latest IoT innovations developed together with our IoT Ecosystem Partners for a diverse range of applications including Smart Transportation, Smart Home, and Smart Security.

The live demos based on the co-created solutions will include:

Smart Navigation

Smart Navigation Solution based on the VIA AMOS-825 for commercial vehicles developed together with leading Japanese navigation software providers Navitime, Increment P, and Mapple.

 


Smart Agriculture

Smart Agriculture solution based on the VIA VAB-630 3.5” board and our new LoRa module, developed together with Green House and Ryoden to enable farmers to collect and analyze critical field data to optimize yields.

 


Smart Vehicle

Smart Transportation solution based on the VIA AMOS-820 and utilizing VIA Smart ETK – an in-vehicle system that collects signals from various sensors connected through GPIO pins to notify the driver if a door is open or if objects are close when backing up.

 


Boards & Systems

In addition to the exciting live demos, visitors will also be able to see our latest line-up of highly-compact embedded boards and systems targeted at a wide range of applications for Smart Industry, Smart Transportation and Smart Enterprise.

 


More Information

For more information please download our product guide or contact us directly to request a meeting during the conference.

We look forward to seeing you in Tokyo Big Sight, booth #W1-26!

Contact Us

 

VIA Technologies, Inc.