Professors Ashok Jhunjhunwala, Jitendra Nandkumar Shah, and Sadagopan to share their extensive experience and insights on implementing innovative programs aimed at bridging the digital divide
Taipei, Taiwan, 20 May 2005 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced an outstanding line-up of highly renowned Indian experts to present their views on the role of ICT (Information and Communication Technology) in economic and social development during the Emerging Market Innovation Technology Track of VTF2005, being held at the Grand Hyatt Hotel, Taipei on Friday 3 June, 2005.
Dr. Ashok Jhunjhunwala, Professor of the Department of Electrical Engineering at the Indian Institute of Technology in Chennai, and head of the Telecommunications and Computer Networks Group (TeNeT) at the same institution, will be sharing his considerable expertise in bringing the benefits of ICT to rural areas, through such innovative technologies as wireless local loop systems, low bit-rate video conferencing and remote medical diagnostics.
Prof. Jitendra Nandkumar Shah, Senior Software Specialist at the Centre for Development of Advanced Computer, India, will address the challenges of localizing software for India’s hundreds of different native languages, while Professor Sadagopan, the founding director of the Indian Institute of Information Technology (IIIT) in Bangalore, will give his insights on how e-government programs have helped to improve the efficiency, transparency, and responsiveness of government services to their local communities.
“It is a great honour for us to have Professors Jhunjhunwala, Shah, and Sadagopan address this year’s VIA Technology Forum, and I am sure the attendees will benefit from their comprehensive practical experience in enabling ICT adoption across India,” commented Richard Brown, Associate Vice President, VIA Technologies, Inc. “VIA has long been committed to empowering people through connectivity, and we feel the time is right to highlight the considerable challenges and benefits that technology can bring to emerging markets in an international setting such as VTF.”
The VTF2005 Emerging Market Innovation Technology Track will take place on Friday June 3 at the Grand Hyatt Taipei. It will explore the nature of multiple emerging markets – from the exciting new applications growing up around embedded platforms to the unique challenges facing developing nations in bridging the digital divide – and analyze the innovative strategies and technologies required to meet the challenges of these diverse contemporary markets.
About the VIA Technology Forum
The annual VIA Technology Forum (VTF) demonstrates VIA’s commitment to develop an innovative open architecture technology platform to enable our partners to take advantage of opportunities, merging the latest technologies with their innovative ideas and business models in the creation of exciting new products and applications. VTF2005 will build upon VIA’s vision for the industry, and examine the technology and application trends, demonstrating how digital brilliance is driving the proliferation of the digital lifestyle.
VTF2005 will feature a comprehensive program of keynote addresses and three specialist technology tracks. The High Definition Computing technology track focuses on advanced technologies driving the PC platform in enterprise computing and the next generation of performance PCs; the Mobile Platforms technology track looks at the transition of mobile x86 systems from PCs to communicating and entertaining devices, emphasizing processor and platform technologies that increase mobility and enhance functionality and the Emerging Market Innovation technology track addresses key platforms and technologies for new markets and highlights strategies to reach the next one billion PC users.
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.viatech.com