The sixth VIA Technology Forum boasts breadth of expertise in keynote addresses by executives from AMD, Elpida, Phoenix and TSMC and across the 3-day program of technology tracks
Taipei, Taiwan, 12 May 2005 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced an outstanding line up of industry leaders to take the keynote podium at the sixth annual VIA Technology Forum (VTF2005) taking place in Taipei from Wednesday 1st June to Friday 3rd June and in Beijing on Tuesday 7th June 2005.
Sharpening the focus on digital brilliance and demonstrating how innovative technologies and exciting product development is driving the creation of real products for the digital lifestyle, Wenchi Chen, President and CEO of VIA Technologies, Inc. will deliver the opening address at VTF2005; he will be followed by Dirk Meyer, President and Chief Operating Officer of AMD, who are celebrating a year of innovation and leading-edge technologies driven by brand-new strategies.
Additionally, the keynote session includes a strong representation from the industry’s leading companies, featuring Dr. F.C. Tseng, Vice Chairman of the Board at TSMC; Albert Sisto, Chairman, President and Chief Executive Officer of Phoenix and Ryoichi Yanai, President of Elpida Memory in Taiwan, who will lead the way in sharing their knowledge and insights on the digital revolution that we experience today.
Broadening the scope of the VIA Technology Forum, VTF2005 boasts three action-packed specialist technology tracks focusing on high definition computing, putting the spotlight on the latest and greatest performance technologies; the proliferation of mobile devices and innovation for emerging markets, including new strategies to enable the next 1 billion PC users to become part of tomorrow’s global digital village. A distinguished list of more than thirty high-level executives, strategists and analysts will be presenting at VTF2005, which has garnered industry support from AMD, Elpida, General Software, Hitachi, Microsoft and Phoenix among other.
“VTF this year is bigger than ever, with three days of in-depth and highly relevant technology tracks that will highlight the strategic directions for the industry and take us beyond our traditional IT borders into exciting new markets,” said Richard Brown, Vice President, International Marketing, VIA Technologies, Inc. “We are particularly pleased with the broad array of prominent speakers, ensuring an interesting and informative event for all attendees.”
For more information on VTF2005, including sponsorship opportunities, agenda, location and registration details, please visit our website at: http://www.via.com.tw/vtf.
About the VIA Technology Forum
The annual VIA Technology Forum (VTF) demonstrates VIA’s commitment to develop an innovative open architecture technology platform to enable our partners to take advantage of opportunities, merging the latest technologies with their innovative ideas and business models in the creation of exciting new products and applications. VTF2005 will build upon VIA’s vision for the industry, and examine the technology and application trends, demonstrating how digital brilliance is driving the proliferation of the digital lifestyle.
VTF2005 will feature a comprehensive program of keynote addresses and three specialist technology tracks. The High Definition Computing technology track focuses on advanced technologies driving the PC platform in enterprise computing and the next generation of performance PCs; the Mobile Platforms technology track looks at the transition of mobile x86 systems from PCs to communicating and entertaining devices, emphasizing processor and platform technologies that increase mobility and enhance functionality and the Emerging Market Innovation technology track addresses key platforms and technologies for new markets and highlights strategies to reach the next billion PC users.
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw
Note to reporters, editors and writers: VIA is written in ALL CAPS.