VIA Announces CN700 IGP Chipset for the VIA C7® Processor

Flagship digital media chipset further facilitates VIA processor platform transition to the VIA V4 bus

Taipei, Taiwan, 8 December 2005 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CN700 IGP chipset, featuring leading digital media technologies and advanced low power design to enable system design innovation across a wide range of VIA C7® processor-powered devices, such as mini PCs, fanless embedded commercial systems and stylish, quiet home entertainment centers for the living room.

The integrated S3 Graphics UniC-Pro IGP core ensures exceptional 2D/3D graphics performance and a truly Hi-Def™ experience, with flexible display outputs for CRT and LCD, as well as standard definition and HDTV up to 1080p resolution with a compatible DVI or TV encoder, while the signature hardware MPEG-2 decoding and the intelligent video rendering techniques of the C-Motion CE Video Display Engine deliver smooth video playback.

Supporting the VIA V4 bus up to 533MHz, the VIA CN700 IGP chipset leverages support for both DDR2 and DDR memory modules with built-in system and graphics power management, to deliver a highly flexible solution for developers looking to design powerful and feature-rich yet compact and quiet desktop and embedded devices.

“The VIA CN700 chipset was specifically designed to enable the VIA C7 processor platform to deliver great system and digital media performance without compromise,” commented Chewei Lin, Vice President of Product Marketing, VIA Technologies, Inc. “With its integrated S3 Graphics UniC-Pro core, and featuring support for the latest DDR2 memory and the high bandwidth V4 bus, the CN700 is equipped with all the right tools to enable a new generation of ultra low power, quiet, compact, stylish and ultra reliable devices.”

Combined with the VIA VT 8237A South Bridge, the VIA CN700 offers a comprehensive range of integrated storage, multimedia and connectivity options, including native Serial ATA and multiple configuration V-RAID, support for VIA Vinyl High Definition Audio, and high-throughput Gigabit Ethernet with the VIA Velocity controller.

Product Availability and Pricing

VIA CN700 is expected to be available in volume quantities in Q1 2006. Pricing is available upon request.

Further information about the VIA CN700 IGP Chipset may be found at the VIA website

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators.

VIA Technologies, Inc.