VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006

Ground-breaking high performance all-in-one x86 chipset for ultra compact embedded systems underscores VIA’s leadership in x86 miniaturization and integration, garners broad industry support

Fremont, California, 4th April 2006 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CX700 digital media IGP chipset for the VIA C7® and Eden™ processor platforms, the most advanced x86 embedded chipset that integrates all the cutting-edge features of a modern chipset’s North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package.

Designed specifically for the embedded market and already adopted by leading industry players, the VIA CX700 will be on display at the VIA booth #1145 and partners’ booths at the Embedded Systems Conference show in San Jose, California this week.

“A true single-chip integration that delivers the performance, flexibility and power efficiency demanded by embedded developers, the CX700 looks set to drive x86 further into the embedded space and enhance VIA’s momentum in this market,” said Chinhwaun Wu, Special Assistant to the President, Processor Platform Product Marketing, VIA Technologies, Inc. “Fully embodying VIA’s design strategy of shrinking the platform while supporting contemporary video, audio, memory and peripheral technologies, the CX700 represents the next phase of innovation in enabling more compact and sophisticated x86 systems.”

Rich Feature Integration

A host of leading digital media, memory and connectivity technologies are packed into the single-chip package of the VIA CX700:

  • Video – Enhanced video quality is provided through the proven VIA UniC-Pro IGP core with its 128-bit 2D/3D graphics, acclaimed hardware MPEG-2 video decoding acceleration and intelligent video rendering technology of the C-Motion CE video display engine; this is complemented by the VIA Vinyl HD Audio controller supporting up to eight high definition channels delivering a richer all-round digital media experience.
  • Memory – VIA’s renowned memory controller technology has been incorporated into the VIA CX700, with support for both DDR400 and the high-bandwidth DDR2533 memory up to 4GB with ECC capability, and 32-bit as well as 64-bit system memory to extend performance, design and cost flexibility to developers.
  • Connectivity – Broad connectivity comes with support for SATA, SATA II and PATA drives, two COM and six USB2.0 ports, and four PCI slots, allowing for considerable flexibility in board configuration. Moreover, developers can also integrate support for ISA through an ITE PCI bridge chip, combining legacy ISA connectivity with high bandwidth DDR2 memory support for far more powerful embedded systems.
  • Display – Flexibility is extended to display technologies, with the VIA CX700 integrating a multi-configuration LVDS/DVI transmitter, a popular feature for embedded systems, as well as standard TV-out, and incorporating DuoView to enable dual screen display.

Stepping Up the Pace of Miniaturization

The VIA CX700 exemplifies VIA’s design philosophy of reducing the size of the platform in order to enable ever smaller, cooler and lighter systems. In the CX700, VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA mainboards.

VIA’s Signature Power Efficiency

Complementing the power-efficient VIA C7 and fanless VIA Eden processors it supports, the VIA CX700 is based on a highly sophisticated power efficient architecture that enables such rich integration into a compact package with a maximum power envelope of just 3.5 watts. A number of key power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements.

Designed for Embedded

Targeted for key embedded applications such as Point of Sales (POS) equipment, industrial PCs (IPC) and ultra compact, low power desktop systems such as thin clients, the VIA CX700 has been designed from the ground up to deliver excellent performance, features and power efficiency. The reduction in board space and operating power requirements together with the extensive multimedia, memory, connectivity and display flexibility provides embedded customers with the ideal chipset to take their ultra compact systems to the next stage.

Broad Industry Support

The benefits of the VIA CX700 have been recognized by several leading embedded industry players, including Advantech, Diamond Systems, Freetech Flexus Computer Technology and WinSystems, some of whom will be showcasing VIA CX700-based boards at ESC, and are full of support for this ground-breaking chipset:

“Until now, creating an ultra-compact form factor mainboard with unparalleled visual connectivity has been a complex process. However, with the VIA CX700 Advantech SOM-ETX solution can offer our customers a solution that supports dual screens, CRT/TV and direct LVDS connection all from a single silicon solution,” said Jeff Chen, Chief Technology Officer, Advantech.

“Highly integrated, very low-power products like the CX700 from VIA are key to small, high-performance single board computer designs,” said Robert A. Burckle, Vice-President of WinSystems. “VIA has engineered the right balance of features and performance into this new x86-compatible chipset that are ideal for the embedded market.”

“VIA’s innovation in its embedded chipset family is setting new standards for low power dissipation at a high performance level in the embedded market place,” said Matt Schiltz, General Software‘s CEO. “We are pleased to offer VIA customers Embedded BIOS® 2000 support for this exciting new member of the VIA family of silicon products, the VIA CX700. General Software is committed to working with VIA to help ensure the continued success of their embedded customers.”

Product Availability and Pricing

The VIA CX700 is expected to be available in volume quantities later in Q2 2006. Pricing is available upon request.

Further information about the single-chip VIA CX700 digital media IGP chipset may be found at the VIA website

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators.

VIA Technologies, Inc.