VIA P4M900 featuring the VIA C-9 IGP core provides powerful new tool for building systems ready for Microsoft® Windows Vista™
Taipei, Taiwan, 30 May 2006 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA P4M900 chipset featuring the VIA C-9 Integrated Graphics Processor core, PCI Express connectivity and DDR2 memory support up to 667MHz for Intel® processors, including the latest Intel Core™ Duo.
Leveraging the power of the VIA C-9 graphics core with DirectX 9.0 and Pixel Shader 2.0 support for high quality video processing, the VIA P4M900 features VIA C-Motion, a powerful image enhancement technology providing a wide range of display options to deliver high quality images on many kinds of devices, including support for HDTV output formats up to 1920x1080p. With additional support for the latest PCI Express add-in graphics cards, the VIA P4M900 provides SIs and OEMs an unparalleled level of performance and flexibility to develop a wide range of next-generation systems in multiple market segments capable of taking advantage of the extended visual desktop experience Microsoft® Windows Vista™ has to offer.
“The VIA P4M900 continues VIA’s strong heritage of IGP solutions for the Intel processor platform,” commented Chewei Lin, Vice President of Product Marketing, VIA Technologies, Inc. “By delivering DirectX 9 capabilities, DDR2 667MHz memory support and additional PCI Express connectivity, the VIA P4M900 gives SIs and OEMs a powerful option to deliver the perfect blend of performance, scalability and reliability to their customers.”
Enabling support for up to 1066MHz FSB Intel processor based systems and DDR2 memory up to 667MHz, the VIA P4M900 features the high-bandwidth Ultra V-Link bus for connecting to VIA’s outstanding range of South Bridge solutions, such as the VIA VT8251 that boasts the integrated VIA Vinyl™ Multichannel Audio Suite delivering rich HD audio at resolutions as high as 32-bit/192kHz, and the VIA Advanced Connectivity Suite offering a wide range of high-bandwidth connectivity options, including support for up to eight high-speed USB 2.0 ports and high-throughput 10/100 Mb/s broadband Ethernet.
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw