VIA Partners with APEC Digital Opportunity Center to Bring ICT to Emerging Markets

VIA first Taiwan vendor to enter ICT Alliance, in line with VIA pc-1 Initiative mission to empower developing nations through technology

Taipei, Taiwan, 4 May 2006 – At a press conference held today in Taipei, VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, entered into a strategic ICT Alliance with the APEC Digital Opportunity Center (ADOC) to help bridge the digital divide in emerging markets within APEC.

With the guiding principle of enabling people to harness the full potential of Information and Communications Technology (ICT), ADOC objectives are fully in line with those of the VIA pc-1 Initiative founded last year.

“VIA and ADOC share the fundamental goal of empowering people and countries through technology, providing a powerful commitment to make a real difference to people’s lives,” said Richard Brown, Vice President of Marketing, VIA Technologies, Inc. “This strategic alliance underlines the importance we place on working with government agencies to facilitate broader ICT adoption that truly meet the needs of emerging markets around the world.”

“We are delighted that VIA has joined us in this vital mission, as it will take companies like VIA with considerable technology resources and know-how to make it happen,” said Li-Chung Shao, APEC Digital Opportunity Center Secretariat. “The ICT Alliance is a practical, sustainable approach to bridging the digital divide while also stimulating local technology growth, a solid cooperation platform for creating win-win situations.”

At the APEC Summit held in Bangkok in 2003, Nobel prize-winner Dr Yuan Tseh Lee, senior statesman for education and technology policy, pledged on behalf of Taiwan to help fellow APEC member nations build their ICT infrastructures and expand their digital capabilities. ADOC was established in 2004 to generate trade and investment by the industry to achieve this goal, and the Institute for the Information Industry in Taiwan (III) has the remit to execute their policies.

VIA is the first vendor in Taiwan to enter into partnership with ADOC in the ICT Alliance, and has been working on the first project under the ADOC umbrella – the establishment of an ICT center at a university in northern Vietnam – which is scheduled to open later this month.

About the VIA pc-1 Initiative

The VIA pc-1 Initiative is aimed at enabling the next one billion people to get connected. With a particular focus on communication, education and information, the VIA pc-1 Initiative seeks to empower millions of people to improve their quality of life through technology, especially in emerging markets. Comprising a range of flexible systems based on VIA’s acclaimed energy-efficient processor platforms, the VIA pc-1 Initiative is a realistic approach to bringing technology to millions more people within a sustainable business framework. Of the numerous initiatives VIA has launched to enhance the technology experience and the quality of life, the VIA pc-1 Initiative has a universal remit to make a difference to the lives of many more millions of people.

About the VIA pc-1 Community Portal

VIA has also launched a community website specifically to cover issues relating to the digital divide, the VIA pc-1 website (, which looks at the real technical, logistical and economic challenges facing the PC, communications and infrastructure industries as well as governments in trying to bridge the digital divide.

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators.

VIA Technologies, Inc.