VIA Shows How Clean Computing Can Halve Power Use at the Green California Exposition

Power efficient and carbon free processor platforms enable up to 50% power saving in computing devices for institutions and businesses

Taipei, Taiwan, March 12, 2007 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, will showcase a range of highly power efficient partner products for enterprise at the Green California Summit and Exposition taking place in Sacramento, California from 13-14 March 2007, booth 1030.

The environment-conscious PCs, thin clients, storage and ultra mobile partner products on display are designed to enable organizations to minimize their carbon footprint as well as make real dollar savings on electricity costs. Thanks to VIA’s ultra power efficient processor platforms, consumers can benefit from:

  • 50% more energy efficient desktop computing platforms
  • 50% increased battery life in ultra mobile devices
  • Thin clients representing 90% energy saving on substitute desktop products

“Addressing environmental issues has become a necessity, requiring the development of computing technologies that consume far lower power as well as working with key partners to enable new product opportunities,” said Epan Wu, Deputy Director of CPU Product Marketing, VIA Technologies, Inc. “VIA’s focus on power efficiency across the whole platform over the past few years is now paying off, with our technologies enabling the design of truly responsible computing products for enterprise and individuals alike.”

Key partner products displayed at the Green California event include compact thin clients from HP, Wyse and DevonIT, slimline ultra mobile devices from a range of leading vendors including Samsung, OQO and TabletKiosk, the Everex StepNote NC1500 notebook and the mass storage Petabox from Capricorn Technologies. Also on show will be the VIA Carbon Free PC reference design, an advanced approach to clean computing.

“Environmental sustainability is a key element of global citizenship at HP, and we are dedicated to reducing our environmental impact, as well as that of our customers, partners, and suppliers by providing a variety of energy-efficient desk-based solutions for business customers,” said Jeff Groudan, worldwide vice president of marketing, Business PCs, HP. “As part of our participation in the Green California event, HP will be showing our thin client systems featuring VIA power-efficient silicon platforms, which are the most energy efficient desktop computing solutions on the market from HP today.”

VIA and the Green California Summit and Exposition 2007

Sustainable technology specialists from California and throughout the world will be sharing their expertise, inventions, experiences and desires at the Sacramento Convention Center from 13-14 March 2007. Long recognized as the “progressive state” on environmental respect and responsibility, California is home to a multitude of key private sector, political and civil society figures in the realm of environmental technologies, legislation and individual practice.

“The Green Summit provides a genuine opportunity for the public and private sectors to bridge gaps and work more closely together to contend with fundamental issues of sustainability” said Scott Phipps, Marketing Manager, VIA Technologies, Inc. Scott will be on hand at the Exposition to address issues of sustainability of technology, and the significant environmental and cost benefits of VIA’s power efficient technologies, as well as their direct applications to governments, companies and end users.

The VIA booth 1030 will be made of recycled or environmentally friendly materials, from the stand structure and literature racks right down to the PET booth carpeting, which was kindly provided by Mohawk, a company responsible for recycling about 25% of the 3 billion soda bottles collected in North America each year by extruding the PET into fiber and spinning it into yarn for carpeting.

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators.

VIA Technologies, Inc.