Driving the Mobility 2.0 lifestyle, the compact, power efficient VIA Ultra Mobile Platform has been adopted for numerous UMDs on show at Computex 2007
Taipei, Taiwan, 6 June 2007 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today proudly announced that the VIA Ultra Mobile Platform has won the prestigious “Best of COMPUTEX” Award for Best IC design at this year’s Computex Taipei 2007.
Comprising the 1GHz VIA C7-M ULV processor and VIA VX700 mobile system media processor, the all-in-one digital media IGP chipset, the VIA Ultra Mobile Platform won the honor due to its ultra power efficient design, rich media integration and significant platform size reduction. The VIA Ultra Mobile Platform for Ultra Mobile Devices (UMDs) can be found inside many ultra mobile products on display at this year’s show.
“We’re delighted to be recognized for our innovative work in designing ultra power efficient mobile processors and highly integrated chipsets,” said Epan Wu, Deputy Director of CPU Product Marketing, VIA Technologies, Inc. “It’s good to have our goal of being the platform of choice for Mobility 2.0 validated by the judges of this prestigious ICT trade show.”
Mobility 2.0 is defined as going beyond today’s limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at the fingertips through the next generation of Ultra Mobile Devices (UMDs). Weighing under a kilogram, UMDs are based on the x86 architecture, and bridge the gap between the notebook and the mobile phone, bringing the benefits of a PC with all the applications, information and entertainment users require to an ultra portable handheld form factor. The VIA Ultra Mobile Platform is the leading choice for companies producing UMDs with more VIA based designs available to consumers on the market today.
About Computex Taipei 2007 and the VIA Technology Forum
Computex 2007, the world’s 2nd largest and the region’s most important ICT exhibition and trade show, takes place this year from June 5-9 at the Taipei World Trade Center. VTF2007, while the eighth annual VIA Technology Forum will be held at the Grand Hyatt Taipei Hotel on Wednesday 6 June 2007. The VIA Technology Forum has firmly established itself as one of the most prominent technology events on the industry’s global calendar, highlighting the principal strategies of VIA and partners and defining key industry trends. This year’s theme is “Ultra Mobility”, a principal element of VIA’s “Small is Beautiful” philosophy, and represents VIA’s strategy to drive the x86 platform into ever smaller and more portable form factors.
About the VIA C7-M Ultra Mobile Platform
The VIA C7-M Ultra Mobile Platform is based on the low power drawing VIA C7-M ULV ultra mobile processor, which has been specifically designed for small form-factor, x86 ultra mobile devices (UMDs). The VIA C7-M ultra mobile processor is based on the VIA CoolStream architecture and is manufactured using IBM’s 90nm SOI process, and has a low profile nanoBGA2 package measuring just 21mm x 21mm. VIA C7-M ULV processors are available at speeds of 1.0-1.5GHz with a maximum thermal design power (TDP) as low as 3.5 watts and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a highly integrated and power efficient unified chipset, enabling designs with drastically reduced weight, size and thickness.
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.viatech.com