Packs the performance, connectivity and functionality of a notebook PC into a sleek and light ultra portable clamshell form factor weighing only 1kg
Taipei, Taiwan, 11 January 2008 – VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, and MAXDATA, one of the top ten European IT manufacturers, today announced the launch of the Belinea s.book 1, a tiny 1kg Mini-Note, on the German market.
Powered by the 1.2GHz VIA C7-M ULV processor, the Belinea s.book 1 delivers the performance, connectivity, and functionality of a conventional notebook PC in a sleek and light form factor that provides an ideal solution for today’s increasingly mobile business users, and will be available now at qualified specialist dealers in Germany for €629, 00 net.
“We are delighted that MAXDATA is bringing the ultra mobile lifestyle to the German market with the Belinea s.book 1,” said Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “With its highly-functional yet ultra compact form factor and extended battery life, it will enable users to enjoy a rich computing and Internet experience at any place and any time.”
“The Belinea s.book 1 is an amazing sub-notebook, and we were able to achieve this size and excellent mobility through the remarkable power efficiency of the VIA C7-M ULV processor,” commented Bernd Maja, Head of Business Unit Notebooks, MAXDATA. “You can travel independently without missing the comfort of a full size notebook.”
About the MAXDATA Belinea s.book 1
The new Belinea s.book 1 delivers an extraordinary combination of high quality, innovation and elegance with its sleek and ultra small form factor, rich functionality, and advanced connectivity features, and makes all-day mobile connectivity and productivity a reality with its long lasting battery life.
Weighing only 1kg and measuring just 230mm x 171mm x 29.4mm, the device features a crisp 7″ WVGA screen supporting 840×480 resolution, and comes with a unique removable Skype module that provides a fast and convenient way for the user to make Internet phone calls while on the go. There are also further MobilityPlus modules planned.
In addition to the 1.2GHz VIA C7-M ULV processor and the VIA VX700 chipset featuring the VIA UniC-Pro II IGP integrated graphics core, the Belinea s.book 1 is equipped with 1GB DDR2 SDRAM, and a 80GB hard drive, and supports Microsoft Windows XP. It also has a full set of connectivity features, including support for 802.11b/g WiFi, Bluetooth and 10/100 Ethernet, as well as a DVI port, two USB 2.0 ports, and Mic-In/Speaker-Out ports.
About the VIA Ultra Mobile Platform
The VIA Ultra Mobile Platform is based on the very low power consuming x86 VIA C7-M ULV processor that has been specifically designed for small form factor Ultra Mobile Devices. The VIA C7-M ULV processor utilizes the advanced VIA CoolStream architecture and is manufactured using an advanced 90nm process for high levels of power efficiency.
VIA C7-M ULV processors are available at speeds from 1.0-1.6GHz with a maximum thermal design power (TDP) of only 3.5 watts, and idle power as low as 0.1 watt, ensuring unparalleled battery life. This is complemented by a low profile nanoBGA2 package measuring just 21mm x 21mm, enabling designs with drastically reduced weight, size, and thickness.
VIA’s core design strengths of low power draw, extreme miniaturization and wide range of integrated features have made the VIA Ultra Mobile Platform the number one choice for Ultra Mobile Devices with over 30 global design wins, the most on the market today.
MAXDATA is one of Europe’s leading computer hardware manufacturers. The Group is represented on the largest European markets with nine national subsidiaries and sells its products under the MAXDATA and Belinea brand names in many other countries. Approximately 1,000 employees are involved in the success of the servers, computers, notebooks and monitors.
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia, and its customer base includes the world,s top OEMs, motherboard vendors and system integrators. www.viatech.com