VIA to showcase its ultra compact, low heat boards and specialist systems at Digital Signage Expo 2008
Taipei, Taiwan, 26 February 2008 – VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced its participation at Digital Signage Expo on February 27th and 28th in Las Vegas. At booth 683, VIA will showcase cutting edge technologies geared towards signage and interactive media systems and point-of-sales networks for retail, hospitality and enterprise.
The trend towards digital signage systems reflects the growing demands for sophisticated audio-visual technology and more complex interactivity in display solutions, and the x86 architecture is fast-emerging as the ideal platform to drive this trend, especially with silicon being designed smaller and cooler-running to fit behind – or even within – display panels.
VIA’s ruthless pursuit of power efficiency in the design of its processor platforms while offering the latest multimedia and connectivity capabilities places VIA at the forefront of this industry transition. At Digital Signage Expo, VIA will show the latest small form factor Nano-ITX boards that natively support dual LCD panels, and the ultra-slim VESA-mountable VIA vmpc vm7700, which features an industry-first thru-chassis mounting design that attaches to the back of any industry standard panel, providing a simple yet flexible way to upgrade display systems.”
“From silicon to board to system design, VIA is recognized as a market leader in the embedded industry, which positions us well to take full advantage of the rapid growth in the digital signage market,” said Daniel Wu, Vice President, VIA Technologies, Inc. “By providing the richest blend of x86 silicon and platforms from a single vendor, along with high levels of reliability and platform compatibility, we can enable signage and kiosk developers to shorten product development cycles and speed time to market with systems that provide the very latest display technologies.”
About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.viatech.com