Pan-industry alliance to outline key technology and usage trends in rapidly growing mini-notebook market
Taipei, Taiwan, 10 March 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Global Mobility Bazaar (GMB) Tech Forum Spring, which will be held on March 17th 2009 in Shenzhen, China.
Building on the success of the first VIA GMB event in October of last year, the VIA GMB Tech Forum Spring will bring together a host of PC manufacturing and infrastructure partners focused on delivering affordable, power efficient mini-notebooks to global markets.
The VIA GMB Alliance was established last year as part of VIA’s long-term commitment to inspire innovation in mobile computing devices by sharing its leading-edge technology and expertise in power efficient x86 processor platforms.
With a rapidly growing membership that includes leading component vendors such as American Megatrends (AMI), InnoLux, ITE Tech, PQI, SanDisk and TD Hi-Tech, the VIA GMB Alliance seeks to facilitate the swift entry of new players into the rapidly growing mini-notebook market, resulting in a broader choice of innovative devices for the consumer.
In the few short months since its formation, the number of VIA GMB Alliance mini-notebook designs has grown to over 50, with a further 50 new designs expected to be rolled out by the end of Q1 2009.
Over 200 VIA GMB Alliance partners have registered to attend the event, where they will observe live demonstrations of the latest mini-notebook technologies, as well as presentations exploring business and technology trends in this rapidly expanding market segment. Topics to be covered include new opportunities for memory module and SSD manufacturers, application utilization tips for embedded controller suppliers, and an overview of a wirelessly networked world and how we to go about getting there.
“With the already strong momentum around mini-notebooks increasing, the VIA GMB Alliance has attracted interest from both established players and new companies wishing to enter the market,” said Richard Brown, Vice President of Marketing, VIA Technologies, Inc. “This is not only a validation of VIA’s vision and strategy for the segment, but an acknowledgment of the tremendous business opportunity that exists around these popular devices.”
About the VIA GMB Alliance
Launched in Shenzhen, China, in October 2008, the VIA Global Mobility Bazaar Alliance was established as part of VIA’s long-term commitment to inspire innovation in mobile computing devices by sharing its leading-edge technology and expertise in power efficient x86 processor platforms.
Leading Chinese manufacturers are participating in the VIA Global Mobility Bazaar, as well as infrastructure partners such as American Megatrends (AMI), InnoLux, ITE Tech, PQI, SanDisk and TD Hi-Tech.
A key focus of the VIA GMB Alliance is to bring innovative mobile computing devices such as mini-notebooks to fast-emerging markets around the world, as well as within China. These markets are among the fastest growing in the world and are developing a keen appetite for mobile computing.
About VIA Ultra Mobile Platforms
VIA Ultra Mobile Platforms are centered on ultra power efficient mobile processors, such as the VIA Nano and VIA C7-M processors, which help ensure longer battery life with great media playback. Coupled with low power, full featured chipsets integrating advanced graphics processors, VIA Ultra Mobile Platforms provide support for brilliant 2D/3D graphics, while the VIA C-Motion video display engine offers a stunning video experience. A top choice for ultra mobile devices, VIA Ultra Mobile Platforms power over 30 global design wins on the market today.
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.viatech.com