VIA strengthens presence in Europe; signs partnership agreement with leading IPC distributor
Taipei, Taiwan, 22 July 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced a commercial agreement with Eurocomposant, a leading distributor of embedded products to industrial and commercial customers in Europe.
Eurocomposant will sell a selection of VIA’s comprehensive range of innovative products, including VIA’s unique range of highly integrated processors, chipsets and companion chips, as well as a variety of ultra compact form factor boards and application specific systems.
“Today’s agreement with Eurocomposant underlines VIA’s commitment to forging a strong bond with Europe’s top tier embedded market players,” said Tiziano Albani, Europe Business Development Director, VIA Technologies, Inc. “VIA is confident that Eurocomposant has the capacity, experience and focus we need to successfully expand our presence in European embedded markets.”
“We are proud to be chosen by VIA Embedded as their partner for France. With the expansion of VIA state-of-the-art chips and its vertically integrated products and systems to our embedded products portfolio, Eurocomposant is assured to become the leading supplier in the French Embedded market arena,” said Ms. Julie Y Fichot, CEO & Marketing Director, Eurocomposant.
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.viatech.com