PC/104 Small Form Factors magazine selects the VIA AMOS-5001 modular chassis kit for its editor
Taipei, Taiwan, Date 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the VIA AMOS-5001 modular chassis kit has been awarded the PC/104 and Small Form Factors magazine Editor’s Choice award, published in the Summer 2011 Resource Guides issue of PC/104 and Small Form Factors magazine. The VIA AMOS-5001 modular chassis kit is a specially designed rugged chassis kit for Em-ITX form factor boards enabling the rapid and easy assembly of a wide variety of robust fanless embedded system designs. The editors from PC/104 and Small Form Factors magazine regularly evaluate innovative new products to select the Editor’s Choice award recipients.
“VIA Technologies has made prototyping hardware and software designs easier with the VIA AMOS-5001 chassis kit,” says Chris A. Ciufo, OpenSystems Media, Group Editorial Director, Military and Aerospace Group. “This flexible kit measures up to be tough enough to withstand harsh conditions but is moldable to many different applications.”
“With the VIA AMOS-5001 we are further expanding the options we offer to embedded developers to create a wealth of unique fanless designs using less time and fewer resources,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “We are honored to receive the Editor’s Choice distinction which confirms our winning broader strategy of providing a comprehensive and flexible product ecosystem that gives our customers a clear advantage in the market.”
About VIA AMOS-5001 Modular Chassis Kit
The VIA AMOS-5001 chassis kit makes it easy to assemble robust x86 embedded systems that can withstand a wide temperature range of -20°c to 55°c and are capable of sustaining a g-force of up to 50. VIA AMOS-5001 chassis are easy to assemble and maintain, utilizing only four separate mechanical parts to form a slim, robust fanless system.
The VIA AMOS-5001 chassis combines with the unique integrated heatsink design found on Em-ITX boards. The discrete aluminum heatsink has direct contact with the processor and chipset on reverse side of the board, forming a solid, robust base for chassis assembly. An optional storage compartment can also be added.
For more information about the VIA AMOS-5001 modular chassis kit please visit:
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About OpenSystems Media
OpenSystems Media has been a leading publisher of electronics magazines, e-mail newsletters, websites, and product resource guides for more than 20 years. OpenSystems Media offers E-casts and Techcasts for engineers and provides interactive tools where engineers can communicate directly with presenters and top industry editors. Current publications include: CompactPCI, AdvancedTCA, & MicroTCA Systems; DSP-FPGA.com; Embedded Computing Design; Industrial Embedded Systems; Military Embedded Systems; PC/104 and Small Form Factors; and VME and Critical Systems. For more information, visit www.opensystemsmedia.com.
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.viatech.com