VIA Announces APC Boot Camp

Taipei, Taiwan, 4 December, 2012 – We are pleased to announce the first APC Boot Camp to bring together hackers, modders and enthusiasts around the goal of creating new connected devices based on the APC platform.

The program kicks off at the VIA global headquarters in Xindian, New Taipei City over the weekend of January 19th and 20th, 2013. It will allow participants to form teams to take on the challenge of designing and building connected hardware devices using the APC platform. Industry experts will be on hand to assist and mentor teams as they work through their prototype builds. Participants will also have the opportunity to experiment with 3D printers for conceptualizing and prototyping.

Who Should Attend?

Anyone who is interested in exploring the potential of creating new devices based on APC, including software developers, product designers, marketers, mechanical engineers, and UI designers is welcome to join. Individuals and pre-formed teams are welcome to register.

Event Schedule

  • The APC Boot Camp will kick off the weekend of January 19th and 20th, 2013
  • Followed by regular progress meet-ups
  • Final showcase event April 14th, 2013


VIA Technologies, Inc., Taipei Headquarters


To register for the event, please click here:

About APC

APC was born from our love of computers and our realization that the PC needs a fundamental redesign. The redesign that we offer is a computer that is more accessible, and more valuable, because you’re not paying for functions that you don’t need and won’t be using. With its small form factor, low power consumption, and customized version of the world’s most popular smart phone operating system, we’ve designed APC to be a bicycle for your mind, enabling ever more people to access to the Internet and opening up exciting opportunities for innovation on the

About VIA Technologies, Inc.

VIA Technologies, Inc. is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators.

VIA Technologies, Inc.