Delivers extreme power efficiency in a ruggedized chassis system for a diversified range of embedded applications
Taipei, Taiwan, 15 January, 2013 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA AMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.
Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA AMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -40°C to 80°C, the VIA AMOS-800 delivers a typical power consumption of a mere 3.14W TDP.
“The VIA AMOS-800 is the first ARM-based system in our ruggedized AMOS systems series,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The high performance and ultra-low power consumption provides an exciting combination for a wide range of industrial embedded applications where robustness is critical.”
The VIA AMOS-800 is specifically designed to support the VIA VAB-800 Pico-ITX board, which features an 800MHz Freescale ARM Cortex-A8 SoC, creating a completely fanless system within a robust chassis measuring 15cm x 4.6cm x 10.8cm (WxDxH). The VIA AMOS-800 has a certified operating temperature range from -40°C to 80°C and offers ultra-low power consumption of only 3.14W TDP under typical operating conditions.
On-board storage includes 4GB of eMMC Flash and can be expanded with the MicroSD Card slot. Front I/O includes one COM, one DIO and one CAN port, as well as Line-in/out and Mic-in, while rear I/O includes, one VGA and one HDMI port, one 10/100 LAN port, and three USB 2.0 ports. An on-board USB pin-header can be utilized to support the optional VNT9271 Wi-Fi USB module.
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About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.viatech.com