Industry leading capabilities will be on display with the VIA ALTA DS system at DSE 2013
Taipei, Taiwan, 26 February, 2013 – VIA Technologies, Inc. today announced its latest Android BSP package for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that provides more dynamic interaction within the limited real-estate of a single screen. VIA is demonstrating the technology with the VIA ALTA DS system at Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28.
The Android BSP enables the combination of app and HTML 5 based content to be displayed simultaneously on a single screen giving system integrators improved flexibility to create engaging multi-touch digital signage systems. This cost-effective solution allows customers to pack more information and richer multimedia content into a single display. The VIA Android BSP provides tremendous opportunities for a broad spectrum of environments including airports, bus and train stations, shopping centers, retail stores as well as a host of other public spaces.
“Customers can maximize the use of existing web-based content by integrating it into digital signage that is placed in key areas for their target market,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “This latest Android BSP is just one example of industry leading innovation VIA Vantage solutions offer for the digital signage market”
For more information about the VIA Vantage ALTA DS System, please visit: http://www.viatech.com/en/products/arm/1910/1/ALTA_DS_System.html
For images related to this release, please visit: http://www.viatech.com/en/systems/android-signage-players/alta-ds/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
VIA PR Contact
Richard Brown Phone: (886)-2-2218-5452 #6201 Fax: (886)-2-8218-6752 Email: RIBrown@via.com.tw