VIA to showcase APC Rock and Paper along with 3D Printing Jam II furnished dollhouses
Taipei, Taiwan, 14 May, 2013 – VIA Technologies, Inc, today announced that it will be taking part in Maker Faire Taipei, which will be held on May 18th-19th, 2013 at Huashan 1914 Creative Park East2C Hall D. The two day event will be showcasing a wealth of creativity and innovation from the Taiwan maker community. APC Rock and Paper will be on display in the VIA booth, along with team BGA’s aquarium monitoring prototype from the APC Boot Camp. Other highlights include a VIA 3D printer and the fully furnished dollhouses from the VIA 3D Printing Jam II last weekend.
The Android based APC Rock and Paper will be featured in the VIA booth along with one of the prototypes built during the APC Boot Camp. Team BGA will have their fish tank monitoring system on display to the public for the first time. The team has created an aquarium monitoring system based on APC Rock. The system incorporates sensors to monitor the temperature of the water, a camera, as well as light and feeding controls. On top of this they have built an app which allows owners to remotely monitor the conditions of the aquarium, adjust temperature and even feed their fish.
For those who missed out on last weekend’s VIA 3D Printing Jam II, we will be displaying the fully furnished dollhouses decorated with the creative 3D printed items produced by the participants at the event. VIA will also be showcasing a 3D printer integrated with a VIA VE-900 Mini-ITX mainboard and custom software.
For more information about Maker Faire Taipei, please visit:
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw