Highly-integrated ultra-compact solution kick starts the development of multimedia-rich embedded Android devices for IoT and M2M deployments
Taipei, Taiwan, 18 September, 2014 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the launch of the VIA ARTiGO A900 Android system.
With its rich 3D graphics and HD video performance, flexible I/O connectivity options, and advanced software development tools, the VIA ARTiGO A900 provides all the key components for building Android-based interactive kiosks, home automation devices, signage, and other HMI solutions in a single compact and durable system.
Featuring an optional Mini HDMI-in port as well as a Mini HDMI-out port, the VIA ARTiGO A900 can be configured to blend locally-captured real-time video streams with cloud-delivered content to create visually-compelling interactive displays for retail, banking, museums, and other environments. Peripheral devices such as sensors, cameras, ticket printers, and barcode and fingerprint scanners can be easily integrated through the system’s Serial, Digital I/O, or USB 2.0 ports, to expand the overall functionality of the installation.
“The VIA ARTiGO A900 takes the headache out of creating innovative embedded Android solutions for a wide variety of fast-emerging IoT and M2M scenarios that require advanced multimedia performance and versatile connectivity options,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “By providing a fully-integrated system that can be easily customized to meet the exact requirements of the target application, it not only significantly reduces development costs but also speeds up time to market.”
Rich Graphics and HD Video Performance
Based on the ultra-compact VIA VAB-1000 Pico-ITX board, the VIA ARTiGO A900 is powered by a 1.0GHz dual core VIA Elite E1000 Cortex-A9 SoC with a high-performance 2D/3D graphics and video engine that supports Open GL ES 3.0 hardware acceleration and simultaneous multiple HD video playback.
Rich I/O & Networking Connectivity in an Ultra-Compact Chassis
The VIA ARTiGO A900 delivers a rich set of I/O features through the front and rear panels of its ultra-compact fanless sealed chassis, measuring just 125mm x 30mm x 120mm (W x H x D). Front panel I/O includes three USB 2.0 ports and line-in/out audio jacks. Rear panel I/O includes two Mini HDMI ports for HDMI-in (project-based support) and HDMI-out, one Digital I/O port supporting 4-bit GPIO, one COM port supporting RS232/485, one Gigabit Ethernet port, one Micro SD card slot, one Mini USB 2.0 port, and one 12V DC-in jack.
The onboard mSATA and Mini-PCIe slots provide versatile system expansion options, including the integration of optional high-speed wireless networking capabilities through a choice of 802.11b/g/n and 3.75G HSP/UMTS mini-PCIe mobile broadband modules. Other onboard features include 2GB DDR3 SDRAM and 4GB eMMC Flash memory. Wake On LAN (WOL) support is also included, making the system an ideal solution for creating remotely-managed IoT devices for almost any environment.
VIA ARTiGO A900 Android BSP
The VIA ARTiGO A900 BSP features Android 4.3 as well as the VIA Smart ETK comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, COM port access, RTC for auto-power on, and a sample app. A full set of software customization services that speed up time to market and minimize development costs is also available.
Availability and Pricing
The VIA ARTiGO A900 is available now. Samples of the system can be purchased online at the VIA Embedded Store at a price of US$350 plus shipping. Please visit here to order: www.viaembeddedstore.com/shop/systems/artigo-a900/
For more information about the VIA ARTiGO A900, please visit: www.viatech.com/en/systems/small-form-factor-pcs/artigo-a900/
For images related to this release please visit: www.viagallery.com/artigo-a900/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.viatech.com
VIA PR Contact
Richard Brown Phone: (886)-2-2218-5452 #6201 Fax: (886)-2-8218-6752 Email: RIBrown@via.com.tw