As summer winds down and focus turns back towards work we have been busy preparing to unveil our fall line of x86 and ARM solutions. We will have some exciting new additions to our low-power small form factor x86 portfolio as well as some interesting surprises in our ARM line-up designed to address the diverse needs that are emerging for smart embedded applications.
As a first step we are pulling back the covers on our new VIA QSM-8Q60 QSeven™ module. Featuring a 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC, the module will expand development avenues within our Freescale™ family of single-board computers and ruggedized system solutions.
With support for a wide operating temperature range from -20°C ~70°C, the VIA QSM-8Q60 delivers high performance and rich multimedia features in the toughest embedded computing environments for applications such as industrial automation, transportation, medical and infotainment. Customers can take advantage of our multi-I/O evaluation carrier board or can utilize our extensive technical support in developing a custom baseboard.
Stay tuned for more…