Latest Innovations from VIA at Embedded World 2016

Latest Innovations from VIA at Embedded World 2016

If you are planning to visit Embedded World this week, please feel free to stop by at the VIA Booth at 4A-251 in Hall 4 of the Nuremberg Exhibition Centre to see our latest Enterprise IoT and Mobile360 innovations.

For those of you who are not at the show, we plan to post a series of updates. Here is a taster of just some of the highlights:

  • 360 Surround ViewVIA Mobile360 In-Vehicle Surround View Fleet Management SystemUtilizing VIA Multi-Stitch technology, the system can seamlessly combine up to 6 camera feeds on the fly to create an encompassing 360° view from a vehicle that can be viewed locally or remotely – providing the ultimate solution for monitoring, security, and tracking.


  • VIA Mobile360 HMI Starter Kits: VIA Mobile360 HMI Starter Kits combine a highly-integrated low-power motherboard with a choice of validated LCD screens to provide the fastest and smoothest path for building a host of Android- and Linux-based all-in-one smart display devices for a wide variety of in-vehicle infotainment and digital signage applications.


  • VIA ETX-8X90-10GR Module: Harnessing the ultra low power consumption and advanced performance of the new VIA Eden® X1 processor, this flexible new module provides a powerful upgrade for systems currently featuring end-of-life processor modules while maintaining full legacy software support.

  • VIA Alegro 100 Smart Home Automation System: With its support for Bluetooth, Wi-Fi, ZigBee, Z-Wave, and KNX-RF, this multi-protocol home gateway device provides a flexible solution for a host of smart home automation applications and can be customized to meet your exact requirements.

If you would like to get a free pass for Embedded World, please register with the code B318992 at For more detailed information about the products we have on display, please feel free to download our new 2016-2017 Product Guide!

VIA Technologies, Inc.