VIA IoT Mobility Platform on Display @ ESEC 2016

VIA IoT Mobility Platform on Display @ ESEC 2016

Come and experience the latest in the VIA IoT Mobility Platform during Japan IT week’s Embedded Systems Expo Conference (ESEC) this May 11th – 13th. On display in the VIA booth, W5-45 West Hall of the Tokyo Big Site, will be a wide range of Enterprise IoT solutions designed to inspire innovation and speed time to market for applications in transportation, healthcare, industrial automation and digital signage.

Highlights in our booth include:

Ubiquitous QuickBoot

By copying only the essential data to RAM during the boot process, advanced QuickBoot technology running on the VIA VAB-820 allows Android or Linux applications to be launched in just a few seconds – a crucial feature for enterprise usages such as advanced industrial and in-vehicle applications.

Mitsui In-Vehicle Remote Monitoring Solution

Leveraging the VIA AMOS-820 as an IoT gateway, this powerful solution serves as an in-vehicle smart management system, enabling remote real-time monitoring, asset management, vehicle maintenance scheduling, and data visualization.

Ryosan Smart Home & Assisted Care Solution

Based on the VIA ARTiGO A900, the system provides a robust home IoT gateway for smart home and managed living environments. With advanced connectivity, the system can automatically collect and manage input from a multitude of sensors, and can also be linked seamlessly to supporting cloud-based services to provide immediate response in case of emergencies.

Also featured in our booth will be more of our latest transportation innovations such as the VIA AMOS-825 In-vehicle IoT system and the VIA Mobile360 Surround View Fleet Management System. Be sure to stop by and see how we can work together to create custom solutions for today’s rapidly-changing market needs.

VIA Technologies, Inc.