VIA and RYOSAN to Unveil IoT Gateway Solution at ESEC 2016

VIA and RYOSAN to Unveil IoT Gateway Solution at ESEC 2016

Highly-customizable Android platform for enabling cloud-based emergency response services in Smart Home and Assisted Living environments

Taipei, Taiwan, 10 May, 2016 – VIA Technologies, Inc, today announced they will be showcasing its highly-customizable new IoT Gateway solution developed in collaboration with Ryosan Co., Ltd. during Japan IT week’s Embedded Systems Expo Conference (ESEC) this May 11th – 13th in booth W5-45 of the West Hall of the Tokyo Big Site International Exhibition Center.

Based on the VIA ARTiGO A900, the system can be easily optimized for specific smart home and managed living environments through the smooth integration of sensors and devices utilizing the VIA Smart ETK. With its advanced connectivity and performance, the system has the capacity to automatically collect and manage input from a multitude of sensors, and can also be linked seamlessly to supporting cloud-based services that can provide immediate response in situations such as fire, intrusion or health emergencies.

“With a rapidly aging population in Japan, there is a huge demand for home monitoring and connected cloud services that will automatically respond to and assist in case of emergency,” commented Satoshi Mizusawa, General Manager, Ryosan Co., Ltd. “Thanks to our close cooperation with VIA, we can quickly penetrate this market and provide customers with a reliable solution that will greatly improve their safety and comfort.”

“The launch of this new IoT Gateway system with Ryosan provides the perfect illustration of the synergies that can be achieved when two companies work closely together to create innovative solutions for emerging IoT markets,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “By leveraging our respective domains of expertise, we have a unique ability to offer tailor-made IoT solutions which can be optimized for target environments.”


The VIA ARTiGO A900 is a fanless ultra-compact Android system that provides blistering 2D/3D graphics and full HD video performance, rich connectivity and networking features, and advanced software development tools for a wide range of interactive kiosk, home automation, signage, HMI, and other advanced IoT and M2M applications.

The VIA ARTiGO A900 BSP features Android 4.4.2 as well as the VIA Smart ETK (Embedded Tool Kit) comprising a number of APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, COM port access, RTC for auto-power on, and a sample app.

For more information about VIA VIA ARTIGO A900, please visit:

For images related to VIA VIA ARTIGO A900:

About Ryosan Co., Ltd.

Ryosan Company, Limited is an electronics trading company that undertakes the sale of semiconductors, electronic components and electronic equipment. From its headquarters in Tokyo, Ryosan operates approximately 50 sales offices globally. Ryosan adopts the “Ryosan spirit” as an identity which is the sense of value that defines and gives direction to its corporate ventures and activities, and will continue to be a corporate group that meets the expectations of society by further boosting its functions as a public institution.

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.

VIA Technologies, Inc.