Flexible ultra-compact module will be on display at VIA Booth at Embedded World 2017
Taipei, Taiwan, February 23, 2017 – VIA Technologies, Inc., today announced the launch of the new VIA SOM-6X50 IoT Acceleration Platform for the rapid development of automated ticketing, signage, and kiosk devices.
“Self-service systems that let consumers access information or purchase items with a tap on the screen or through their smart phone are critical for improving the user experience no matter whether it’s at a retail store or a parking lot,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “With our latest VIA SOM-6X50 IoT Acceleration Platform, we make it fast and easy for operators to design and build automated information display and transaction processing systems that meet their exact deployment needs.”
The VIA SOM-6X50 is an ultra-compact system-on-module that measures a mere 6.76cm x 4.3cm. Powered by a 1.0GHz VIA Cortex-A9 SoC, it delivers the perfect balance of performance and rich multimedia features in a highly-flexible package for a wide range of IoT automation and HMI applications.
I/O and display expansion options include two USB 2.0 ports, one USB 2.0 device port, one HDMI port, one single-channel 18/24-bit LVDS panel, six UART, one CSI camera input, 10/100Mbps Ethernet, eleven GPIO and one SD Card slot. The VIA SOMDB1 carrier board multi-I/O evaluation carrier board is available. A custom baseboard can be also be developed meet specific requirements.
The VIA SOM-6X50 features a Linux BSP which includes the kernel (3.4.5) and bootloader source codes. Other features include a Tool Chain to help adjust the kernel and to support the VIA SOMDB1 carrier board I/O and other hardware features.
The VIA SOM-6X50 IoT Acceleration Platform will be on display at the VIA booth at the 2017 Embedded World Exhibition and Conference being held this March 14-16 in Nuremberg, Germany. The booth is located #2-551 in Hall 2 of the Nuremberg Exhibition Center. Other highlights include a broad spectrum of commercial-grade systems, HMI starter kits, and IoT acceleration platforms that can be rapidly customized for in-vehicle and in-station applications.
For more information about the VIA SOM-6X50, please visit: https://www.viatech.com/en/boards/modules/som-6×50/
For more information about VIA at Embedded World 2017, please visit: https://www.viatech.com/en/embedded-world-2017
For more information about VIA Custom IoT Design Services, please visit: http://www.viatech.com/en/services/hw-engineering/arm/custom-design/
For images related to this release, please visit: http://www.viagallery.com/som-6×50/
About VIA Technologies, Inc.
VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com