For the VIA Edge AI Developer Kit, we have carefully selected and tested all its hardware components to ensure fast and easy assembly as well as the highest levels of quality, reliability, and performance.
The core components of the kit are of course the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board that combine the advanced graphics and compute capabilities of the Qualcomm® Snapdragon™ 820E Embedded Platform with a full suite of wireless connectivity features including 802.11 a/b/g/n/ac Wi-Fi, Bluetooth 4.1, and GPS.
A wide array of I/O and display expansion options are available through the module’s MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. Information on how to get these up and running is available in the SOM-9X20 User Manual.
To facilitate the integration of a camera for Edge AI video applications, we have also included a 13MP CMOS camera module (COB 1/3.06” 4224×3136 pixels), a Camera-to-CSI converter board, and an FPC cable for the CSI connector in one of the available SKUs. The camera module has undergone stringent performance and quality testing procedures and we can work with you to optimize the drivers for specific applications. Naturally, the kit also supports other CSI camera modules as well should you choose to adopt them.
The other hardware components in the kit have also been carefully tested for reliability and ease of integration. They include one COM cable, one AC adapter, one US-type power adapter, one US-type power cord, and antennas for Wi-Fi and Bluetooth.
The VIA Edge AI Developer Kit provides a tightly-integrated hardware package for your Edge AI system. To learn how to install it, please download the VIA Edge AI Developer Kit Quick Guide. If you have any questions about the components that are used in the kit, please contact us at: firstname.lastname@example.org.