VIA Releases Linux BSP for VIA SOM-9X20 Module Powered by Qualcomm® Snapdragon™ 820E Embedded Platform

linux bsp qualcomm snapdragon 820e

Enables rapid development of next-generation Edge AI systems and devices

Taipei, Taiwan, June 28, 2018 – VIA Technologies, Inc., today announced the release of a Linux BSP based on Yocto 2.0.3 for the VIA SOM-9X20 Module.

Key features in the BSP are the following:

  • Supports UFS boot
  • Supports HDMI display
  • Supports AUO MIPI capacitive touch panels through USB interface
  • AUO 10.1” B101UAN01.7 (1920×1200)
  • Supports COM as debug port
  • Supports two Gigabit Ethernet
  • Supports Mic-in and stereo 2W speaker
  • Supports built-in Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 4.1, and GPS
  • Supports MIPI CSI camera OV13850

“The release of the Linux BSP gives our customers an additional option for the development of Edge AI systems and devices powered by the Qualcomm® Snapdragon™ 820E Embedded Platform,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “VIA also provides a full set of system hardware and software customization services that boost time to market and minimize development costs.”


The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm Snapdragon 820E embedded platform. Measuring just 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. A choice of BSPs based on Android 8.0 or Yocto 2.0.3 is available.

For more information about the VIA SOM-9X20 please visit:×20

For images related to this release, please visit:×20/

Availability and Pricing

The VIA SOM-9X20 and SOMDB2 Carrier Board are available from the VIA Embedded online store for US$569 plus shipping at:

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for AI, IoT, computer vision, autonomous vehicle, healthcare, and smart city applications. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia. Its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names.

VIA Technologies, Inc.