VIA Launches VIA ALTA DS 3 Edge AI System powered by Qualcomm® Snapdragon™ 820E Embedded Platform

Alta DS3-banner

Accelerates development and deployment of intelligent edge devices for New Retail applications that boost customer convenience and engagement

Taipei, Taiwan, September 25, 2018 – VIA Technologies, Inc., today announced the launch of the VIA ALTA DS 3 Edge AI system. Powered by the Qualcomm® Snapdragon 820E Embedded Platform, the system enables the rapid development and deployment of intelligent signage, kiosk, and access control devices that require real-time image and video capture, processing, and display capabilities.

The VIA ALTA DS 3 harnesses the cutting-edge compute, graphics, and AI processing capabilities of the Qualcomm® Snapdragon™ 820E Embedded Platform to facilitate the creation of vibrant new user experiences by allowing customers to combine their own AI applications with immersive multimedia signage display content in a compact, low-power system.

In addition to dual 4K display support, including dual display mirror & independent video playback modes, the system also delivers rich network connectivity through its Gigabit Ethernet port plus a choice of Wi-Fi & Bluetooth 4.1 or 4G LTE wireless integration options. Its durable small form factor chassis also offers flexible camera and I/O peripheral expandability through its three USB 3.0 ports, one Mini USB 2.0 port, and one miniPCIe slot. Other features include 4GB POP LPDDR4 RAM, 16GB eMMC flash memory, one M.2 slot, one SD card slot, and line-out and mic-in audio jacks.

To facilitate software and AI application development, the VIA ALTA DS 3 comes with a BSP featuring Android 8.0 which includes the Qualcomm® Neural Processing SDK for artificial intelligence designed to help developers run one or more neural network models trained in Caffe/Caffe2, ONNX, or TensorFlow using the CPU, GPU or DSP.

“The VIA ALTA DS 3 provides tightly-integrated system platform that accelerates innovation at the edge for multimedia-rich New Retail applications that boost customer convenience and engagement,” commented Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “With its flexible hardware and software customization options, the system can be optimized to meet your exact edge AI installation requirements while providing the scalability required for future enhancements.”

 

Availability

The VIA ALTA DS 3 is available now for shipment worldwide.

System samples can be ordered online for US$399 plus shipping at https://www.viaembeddedstore.com/shop/systems/alta-ds-3/

For more information about the system, please visit: https://www.viatech.com/en/systems/android-signage-players/alta-ds-3/

For images related to this release, please visit: https://www.viagallery.com/alta-ds-3/

 

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for AI, IoT, computer vision, autonomous vehicle, healthcare, and smart city applications. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia. Its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com

Note to reporters, editors and writers: VIA is written in ALL CAPS.

Powered by the Qualcomm® Snapdragon™ 820E Embedded Platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Spectra is a trademark of Qualcomm Incorporated.

Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

 

VIA Technologies, Inc.