VIA at Embedded World 2019: Adding Intelligence to Buildings with the VIA ARTiGO A820

smart building solutions

Bringing Senses and Activity to Static Environments

Smart buildings – whether enterprise, commercial, or residential – that are aware of and react to their environment can bring considerable benefits to both owners and users, including lower energy consumption, predictive maintenance alerts for HVAC equipment, better security, increased occupant comfort and safety, and better utilization of building assets and services. This improves the immediate environment as the building actively and intelligently reacts to the ebb and flow of everyday life, while also acting to reduce energy consumption and positively contributing to the fight against climate change.

VIA has developed a growing range of smart building solutions that enable hybrid processing between edge device and cloud and provide the flexibility required to address crucial issues, such as centralized management and data collection balanced against available bandwidth, time-to-action latency, connection reliability, security, and cost.

At Embedded World 2019, VIA will be showcasing the latest of these solutions, including the VIA ARTiGO A820 system integrating FogHorn Lightning edge intelligence software and connectivity to Microsoft Azure Cloud services.

smart building solutions

Power-Efficient Edge-Compute Capabilities

The VIA ARTiGO A820 provides the optimum flexibility for smart building installations with its power-efficient edge-compute capabilities and extensive feature set. The system’s rich I/O provides diverse integration options for environmental monitoring and control devices such as humidity and temperature sensors that connect via RS485. Its 1.0GHz NXP i.MX 6DualLite dual-core Cortex-A9 SoC delivers the performance required for real-time data processing using machine learning software from FogHorn that actively monitors environmental behavior and sends alerts to the Microsoft Azure cloud whenever it detects abnormalities.

With its intelligent, real-time monitoring and predictive operational intelligence capabilities and its cloud connectivity, the VIA ARTiGO A820 makes it easy for building owners and managers not only to remotely monitor environmental control devices and systems but also to make them actively self-adjusting. For example, as the temperature rises during the morning the system can trigger the connected cooling and dehumidifying apparatus, rather than at fixed times of day regardless of the daily weather – optimizing energy usage and maximizing environmental comfort in the building.

Deep Analytics Insights

The VIA ARTiGO A820 allows deployments to scale quickly and easily because the hardware, software, and cloud components it employs are reliable, trusted and highly-flexible to implement. By processing actions on-device it removes the need for absolute connection reliability to the cloud service as constant feedback is not required. By considerably reducing outward data-flow it minimizes network load, processing latency and even bandwidth cost if data services are metered. This translates into a lower cost of operation as real-time management can be optimized and largely automated, while its machine learning capability is able to spot abnormalities that could be a prelude to an equipment failure – lowering repair costs and minimizing downtime.

Longer term, the data collected builds a bigger picture that provides deep analytics insights. This allows the easy identification of long-term trends and potentially even building-level optimizations through operational tweaks or future upgrades that would be otherwise invisible in a distributed or separated system.

Ultra-Reliable Scalable Design

The VIA ARTiGO A820 can be used to control many aspects of smart buildings, from environmental services, utilities and power, to safety and security. Its ultra-reliable design, low operating cost, and longevity support reduce investment risk, making it the ideal solution for long-term smart building deployments.

To learn more about the system and other members of our growing family of smart building solutions, please visit the VIA booth at Embedded World 2019, located at #2-551 in Hall 2 of the Nuremberg Exhibition Center in Germany.

VIA Technologies, Inc.