VIA Announces IoT and Edge AI Systems certified for Microsoft IoT Plug and Play

mircosoft IoT PnP

IoT Plug and Play certified VIA devices for industrial, enterprise and transportation applications to be demoed at Microsoft Build developer conference, Seattle

Taipei, Taiwan, May 7, 2019 – VIA Technologies, Inc. today announced its leading IoT and Edge AI systems are certified for Microsoft’s IoT Plug and Play, ensuring seamless integration for customers leveraging Microsoft Azure. Certified systems will be showcased as IoT Plug and Play devices at the Microsoft Build 2019 developer conference on May 6-8, 2019.

“IoT Plug and Play underlines our commitment to providing a streamlined and optimized deployment path for customers using the Microsoft Azure platform, a major advantage in today’s competitive and quickly evolving market,” commented Richard Brown, VP of International Marketing, VIA Technologies, Inc. “It’s great to see VIA systems showcased at Microsoft Build 2019 as part of the Azure Certified for IoT catalog.”

“Leveraging several decades of collaboration with hardware vendors, we can now accelerate the transition to IoT for enterprise customers,” said Sam George, director, Azure IoT at Microsoft Corp.  “IoT Plug and Play guarantees smooth and rapid integration with the Microsoft Azure cloud eco-system and leading hardware vendors like VIA who are building the hardware backbone of this new connected world.”

Microsoft  IoT Plug and Play

IoT Plug and Play certified devices are added to the Azure IoT Device Catalog and part of the Azure Certified for IoT program. Certification ensures that IoT solution providers can enjoy seamless compatibility with the Microsoft Azure ecosystem. By selecting certified devices, solution builders can reduce engineering and integration costs and accelerate time to market

The following VIA systems and platforms are IoT Plug and Play certified; the VIA ARTiGO A820, VIA AMOS 3005, VIA AMOS-820 and VIA AMOS-825 edge computing systems, the VIA Mobile360 D700 drive recorder, and the VIA SOM-9X20 embedded module.

The Azure IoT Device Catalog will be showcased at the Microsoft Build 2019 developer conference event in Seattle at the Washington State Convention Center on May 6-8. Find more information here: https://catalog.azureiotsolutions.com/

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for AI, IoT, computer vision, autonomous vehicle, healthcare, and smart city applications. Headquartered in Taipei, Taiwan, VIA’s global network links the high-tech centers of the US, Europe and Asia. Its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com

VIA Technologies, Inc.