We plan to introduce a number of new products at Embedded World 2020 next week, starting with the latest addition to our highly successful family of ruggedized VIA AMOS-3000 Series systems for commercial, industrial, and embedded computing applications.
The VIA AMOS-3006 embedded transportation system continues with this tradition, sporting a tough and durable enclosure able to withstand the most challenging indoor and outdoor operating conditions and temperature ranges. With its two CAN Bus ports and integrated power module supporting a wide voltage range and smart power management for vehicles, the system is also designed for fleet management installations.
Just like other models in the VIA AMOS-3000 Series, the system provides rich compute and multimedia functionality and offers extensive internal and external connectivity, peripheral, and storage expansion options.
In addition to integrated dual Gigabit Ethernet, the system supports dual 4G SIM cards and dual Wi-Fi to enable high-speed broadband connectivity. It also comes equipped with a wealth of I/O ports including two USB 3.0 ports, two lockable USB ports for enhanced security, two RS-232 COM and two RS-232/422/485 COM ports for integrating legacy peripherals, and one HDMI and one VGA port for attaching different types of displays. Internal expansion options include one mSATA connector, two mini PCIe slots, and one SODIMM slot that supports up to 8GB 1333MHz DDR3 memory.
The VIA AMOS-3006 is fully compatible with Microsoft® Windows® 10 IoT, Windows® 10, 8.1, and 8, and Windows® Embedded Standard 7 operating systems, as well as popular Linux distributions. Hardware and software customization services are available to meet specific deployment needs.
Learn more about the VIA AMOS-3006 embedded transportation system, and find more images here on the VIA Gallery. You can also catch it at the VIA booth at Embedded World 2020. Our booth is located in the same spot as in previous years in Hall 2, #2-551. You can find out more about our plans for the show here.
Written by Richard Brown, Vice-President of International Marketing at VIA.